Inventor
Xiao li hong
CN87 patents
Patents
50 patentsUS10930661B2Feb 23, 2021
Embedded pad structures of three-dimensional memory devices and fabrication methods thereof
YANGTZE MEMORY TECH CO LTD16 citations94
US10636813B1Apr 28, 2020
Three-dimensional memory devices having transferred interconnect layer and methods for forming the same
YANGTZE MEMORY TECH CO LTD37 citations94
US10600781B1Mar 24, 2020
Multi-stack three-dimensional memory devices
YANGTZE MEMORY TECH CO LTD37 citations94
US10600763B1Mar 24, 2020
Multi-deck three-dimensional memory devices and methods for forming the same
YANGTZE MEMORY TECH CO LTD34 citations94
US10510415B1Dec 17, 2019
Memory device using comb-like routing structure for reduced metal line loading
YANGTZE MEMORY TECH CO LTD36 citations94
US10950623B2Mar 16, 2021
3D NAND memory device and method of forming the same
YANGTZE MEMORY TECH CO LTD9 citations86
US10453860B1Oct 22, 2019
Method of forming staircase structures for three-dimensional memory device double-sided routing
YANGTZE MEMORY TECH CO LTD16 citations86
US11081496B2Aug 3, 2021
Three-dimensional memory devices and fabrication methods thereof
YANGTZE MEMORY TECH CO LTD7 citations84
US11011540B2May 18, 2021
Three-dimensional memory devices and fabrication methods thereof
YANGTZE MEMORY TECH CO LTD5 citations84
US10985142B2Apr 20, 2021
Multi-deck three-dimensional memory devices and methods for forming the same
YANGTZE MEMORY TECH CO LTD6 citations84
US10964718B2Mar 30, 2021
Three-dimensional memory devices and fabrication methods thereof
YANGTZE MEMORY TECH CO LTD7 citations84
US10797028B2Oct 6, 2020
Three-dimensional memory devices with stacked device chips using interposers
YANGTZE MEMORY TECH CO LTD6 citations84
US10608013B1Mar 31, 2020
3D memory device and method for forming 3D memory device
YANGTZE MEMORY TECH CO LTD8 citations84
US10483280B1Nov 19, 2019
Method of forming staircase structures for three-dimensional memory device double-sided routing
YANGTZE MEMORY TECH CO LTD7 citations84
US10868031B2Dec 15, 2020
Multiple-stack three-dimensional memory device and fabrication method thereof
YANGTZE MEMORY TECH CO LTD5 citations83
US10680003B2Jun 9, 2020
Staircase structure for memory device
YANGTZE MEMORY TECH CO LTD6 citations83
US10672711B2Jun 2, 2020
Word line contact structure for three-dimensional memory devices and fabrication methods thereof
YANGTZE MEMORY TECH CO LTD7 citations83
US10658378B2May 19, 2020
Through array contact (TAC) for three-dimensional memory devices
YANGTZE MEMORY TECH CO LTD9 citations82
US11605644B2Mar 14, 2023
Memory stacks having silicon nitride gate-to-gate dielectric layers and methods for forming the same
YANGTZE MEMORY TECH CO LTD4 citations75
US11706920B2Jul 18, 2023
Three-dimensional memory devices and fabrication methods thereof
YANGTZE MEMORY TECH CO LTD2 citations73
US11430811B2Aug 30, 2022
3D NAND memory device with select gate cut
YANGTZE MEMORY TECH CO LTD1 citations73
US11404441B2Aug 2, 2022
3D NAND memory device and method of forming the same
YANGTZE MEMORY TECH CO LTD2 citations73
US11114456B2Sep 7, 2021
Memory stacks having silicon oxynitride gate-to-gate dielectric layers and methods for forming the same
YANGTZE MEMORY TECH CO LTD2 citations73
US11043506B2Jun 22, 2021
Three-dimensional memory device having a shielding layer and method for forming the same
YANGTZE MEMORY TECH CO LTD2 citations73
US11031413B2Jun 8, 2021
Three-dimensional memory devices and fabricating methods thereof
YANGTZE MEMORY TECH CO LTD4 citations73
US11011539B2May 18, 2021
Multi-stack three-dimensional memory devices and methods for forming the same
YANGTZE MEMORY TECH CO LTD5 citations73
US11004861B2May 11, 2021
Three-dimensional memory devices and fabrication methods thereof
YANGTZE MEMORY TECH CO LTD5 citations73
US10892277B2Jan 12, 2021
High-κ dielectric layer in three-dimensional memory devices and methods for forming the same
YANGTZE MEMORY TECH CO LTD6 citations73
US10878911B2Dec 29, 2020
Memory device using comb-like routing structure for reduced metal line loading
YANGTZE MEMORY TECH CO LTD1 citations73
US10797075B2Oct 6, 2020
Staircase and contact structures for three-dimensional memory
YANGTZE MEMORY TECH CO LTD2 citations73
US10784225B2Sep 22, 2020
Bonded semiconductor structures having bonding contacts made of indiffusible conductive materials and methods for forming the same
YANGTZE MEMORY TECH CO LTD4 citations73
US10770478B1Sep 8, 2020
Methods for forming three-dimensional memory device having bent backside word lines
YANGTZE MEMORY TECH CO LTD2 citations73
US10762965B2Sep 1, 2020
Memory device using comb-like routing structure for reduced metal line loading
YANGTZE MEMORY TECH CO LTD2 citations73
US11145666B2Oct 12, 2021
Staircase structure for memory device
YANGTZE MEMORY TECH CO LTD1 citations72
US10910390B2Feb 2, 2021
Memory device and forming method thereof
YANGTZE MEMORY TECH CO LTD1 citations72
US10515975B1Dec 24, 2019
Method for forming dual-deck channel hole structure of three-dimensional memory device
YANGTZE MEMORY TECH CO LTD6 citations72
US10937806B2Mar 2, 2021
Through array contact (TAC) for three-dimensional memory devices
YANGTZE MEMORY TECH CO LTD2 citations71
US12219773B2Feb 4, 2025
Embedded pad structures of three-dimensional memory devices and fabrication methods thereof
YANGTZE MEMORY TECH CO LTD0 citations63
US11943923B2Mar 26, 2024
Three-dimensional memory devices and fabrication methods thereof
YANGTZE MEMORY TECH CO LTD0 citations63
US11849582B2Dec 19, 2023
Memory stacks having silicon nitride gate-to-gate dielectric layers and methods for forming the same
YANGTZE MEMORY TECH CO LTD0 citations63
US11844216B2Dec 12, 2023
Three-dimensional memory devices and fabricating methods thereof
YANGTZE MEMORY TECH CO LTD0 citations63
US11800710B2Oct 24, 2023
Three-dimensional memory devices and fabricating methods thereof
YANGTZE MEMORY TECH CO LTD0 citations63
US11758731B2Sep 12, 2023
Three-dimensional memory device having a shielding layer and method for forming the same
YANGTZE MEMORY TECH CO LTD0 citations63
US11758729B2Sep 12, 2023
Three-dimensional memory device having a shielding layer and method for forming the same
YANGTZE MEMORY TECH CO LTD0 citations63
US11665903B2May 30, 2023
Three-dimensional memory devices and fabrication methods thereof
YANGTZE MEMORY TECH CO LTD0 citations63
US11581332B2Feb 14, 2023
Three-dimensional memory devices and fabrication methods thereof
YANGTZE MEMORY TECH CO LTD0 citations63
US11508745B2Nov 22, 2022
Three-dimensional memory device having a shielding layer and method for forming the same
YANGTZE MEMORY TECH CO LTD0 citations63
US11502102B2Nov 15, 2022
Three-dimensional memory devices and fabrication methods thereof
YANGTZE MEMORY TECH CO LTD0 citations63
US11462565B2Oct 4, 2022
Three-dimensional memory devices and fabrication methods thereof
YANGTZE MEMORY TECH CO LTD0 citations63
US11443807B2Sep 13, 2022
Memory device using comb-like routing structure for reduced metal line loading
YANGTZE MEMORY TECH CO LTD0 citations63
Showing the top 50 of 87 patents by PatentIndex Score.