Inventor
MIYAZAWA YASUNAO
JP6 patents
Patents
6 patentsUS5110388AMay 5, 1992
Method of dicing and bonding semiconductor chips using a photocurable and heat curable adhesive tape
LINTEC CORP150 citations98
US5356949AOct 18, 1994
Adhesive composition comprising (meth)acrylate polymer and epoxy resin
LINTEC CORP75 citations95
US5118567AJun 2, 1992
Adhesive tape and use thereof
LINTEC CORP100 citations95
US6584858B1Jul 1, 2003
Device and method for measuring adhesive strength
LINTEC CORP42 citations89
US6331071B2Dec 18, 2001
Stirring device
LINTEC CORP16 citations89
US6244741B1Jun 12, 2001
Stirring device
LINTEC CORP16 citations89