Inventor
KUTLU ZAFER S
US10 patents
⚠️ This page may combine multiple inventors who share the name “KUTLU ZAFER S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LSI LOGIC CORP
7 patentsUS6114761ASep 5, 2000
Thermally-enhanced flip chip IC package with extruded heatspreader
LSI LOGIC CORP152 citations97
US6472762B1Oct 29, 2002
Enhanced laminate flipchip package using a high CTE heatspreader
LSI LOGIC CORP134 citations96
US6590292B1Jul 8, 2003
Thermal and mechanical attachment of a heatspreader to a flip-chip integrated circuit structure using underfill
LSI LOGIC CORP49 citations95
US6111313AAug 29, 2000
Integrated circuit package having a stiffener dimensioned to receive heat transferred laterally from the integrated circuit
LSI LOGIC CORP58 citations95
US7096748B2Aug 29, 2006
Embedded strain gauge in printed circuit boards
LSI LOGIC CORP19 citations91
US6673708B1Jan 6, 2004
Thermal and mechanical attachment of a heatspreader to a flip-chip integrated circuit structure using underfill
LSI LOGIC CORP11 citations72
US6465338B1Oct 15, 2002
Method of planarizing die solder balls by employing a die's weight
LSI LOGIC CORP1 citations51