Inventor
HAN LUNG-TIEN
US3 patents
Patents
3 patentsUS7524750B2Apr 28, 2009
Integrated process modulation (IPM) a novel solution for gapfill with HDP-CVD
APPLIED MATERIALS INC55 citations96
US7244658B2Jul 17, 2007
Low stress STI films and methods
APPLIED MATERIALS INC4 citations61
US6524969B2Feb 25, 2003
High density plasma chemical vapor deposition (HDP-CVD) processing of gallium arsenide wafers
APPLIED MATERIALS INC1 citations48