Inventor

KAKIZONO YUICHI

JP4 patents

⚠️ This page may combine multiple inventors who share the name “KAKIZONO YUICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HASHII TOMOHIRO

2 patents

US8092277B2Jan 10, 2012

Method of grinding semiconductor wafers, grinding surface plate, and grinding device

HASHII TOMOHIRO4 citations56

US9550264B2Jan 24, 2017

Fixed abrasive-grain processing device, method of fixed abrasive-grain processing, and method for producing semiconductor wafer

HASHII TOMOHIRO0 citations35

SUMCO CORP

1 patent

US7288207B2Oct 30, 2007

Etching liquid for controlling silicon wafer surface shape and method for manufacturing silicon wafer using the same

SUMCO CORP4 citations60

KUROSAWA YOSHIAKI

1 patent

US9017145B2Apr 28, 2015

Polishing solution distribution apparatus and polishing apparatus having the same

KUROSAWA YOSHIAKI0 citations37