Inventor
YOUN HAN SHIN
KR20 patents
⚠️ This page may combine multiple inventors who share the name “YOUN HAN SHIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HYUNDAI MOTOR CO LTD
12 patentsUS9866130B1Jan 9, 2018
DC-DC converter and control method thereof
HYUNDAI MOTOR CO LTD13 citations82
US10618426B2Apr 14, 2020
Method and system for controlling vehicle during charging
HYUNDAI MOTOR CO LTD5 citations72
US10554113B1Feb 4, 2020
Control system and method of low voltage DC-DC converter
HYUNDAI MOTOR CO LTD2 citations72
US11271417B2Mar 8, 2022
System and method for controlling charge and discharge of battery
HYUNDAI MOTOR CO LTD3 citations71
US11124083B2Sep 21, 2021
Periodic supplementary charge method for battery of vehicle
HYUNDAI MOTOR CO LTD1 citations62
US11135927B2Oct 5, 2021
Four wheel drive vehicle
HYUNDAI MOTOR CO LTD1 citations61
US12522082B2Jan 13, 2026
Solar cell system
HYUNDAI MOTOR CO LTD0 citations51
US12113430B2Oct 8, 2024
Converter using active clamp and solar cell system having the same
HYUNDAI MOTOR CO LTD0 citations51
US11110801B2Sep 7, 2021
Fault diagnosis system of power converter for electric vehicle
HYUNDAI MOTOR CO LTD0 citations51
US11376976B2Jul 5, 2022
Vehicle charger and method for controlling the same
HYUNDAI MOTOR CO LTD0 citations50
US11260766B2Mar 1, 2022
System and method for controlling low voltage DC-DC converter for vehicle
HYUNDAI MOTOR CO LTD0 citations50
US10756551B2Aug 25, 2020
Charging system with sensor diagnosis function and method of diagnosing sensor applied to the same
HYUNDAI MOTOR CO LTD0 citations41
SAMSUNG ELECTRONICS CO LTD
5 patentsUS7504736B2Mar 17, 2009
Semiconductor packaging mold and method of manufacturing semiconductor package using the same
SAMSUNG ELECTRONICS CO LTD11 citations84
US7436049B2Oct 14, 2008
Lead frame, semiconductor chip package using the lead frame, and method of manufacturing the semiconductor chip package
SAMSUNG ELECTRONICS CO LTD7 citations73
US7952199B2May 31, 2011
Circuit board including solder ball land having hole and semiconductor package having the circuit board
SAMSUNG ELECTRONICS CO LTD4 citations61
US9018041B2Apr 28, 2015
Package for semiconductor device including guide rings and manufacturing method of the same
SAMSUNG ELECTRONICS CO LTD1 citations51
US7667325B2Feb 23, 2010
Circuit board including solder ball land having hole and semiconductor package having the circuit board
SAMSUNG ELECTRONICS CO LTD1 citations50