Inventor
CALETKA DAVID V
US23 patents
⚠️ This page may combine multiple inventors who share the name “CALETKA DAVID V”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
19 patentsUS6913948B2Jul 5, 2005
Partially captured oriented interconnections for BGA packages and a method of forming the interconnections
IBM126 citations99
US6507116B1Jan 14, 2003
Electronic package and method of forming
IBM107 citations98
US6274474B1Aug 14, 2001
Method of forming BGA interconnections having mixed solder profiles
IBM88 citations98
US6104093AAug 15, 2000
Thermally enhanced and mechanically balanced flip chip package and method of forming
IBM92 citations97
US6774474B1Aug 10, 2004
Partially captured oriented interconnections for BGA packages and a method of forming the interconnections
IBM66 citations96
US6410988B1Jun 25, 2002
Thermally enhanced and mechanically balanced flip chip package and method of forming
IBM45 citations96
US6695623B2Feb 24, 2004
Enhanced electrical/mechanical connection for electronic devices
IBM54 citations93
US6933619B2Aug 23, 2005
Electronic package and method of forming
IBM34 citations92
US6541857B2Apr 1, 2003
Method of forming BGA interconnections having mixed solder profiles
IBM35 citations92
US6333551B1Dec 25, 2001
Surface profiling in electronic packages for reducing thermally induced interfacial stresses
IBM26 citations92
US5873740AFeb 23, 1999
Electrical connector system with member having layers of different durometer elastomeric materials
IBM29 citations92
US6138893AOct 31, 2000
Method for producing a reliable BGA solder joint interconnection
IBM26 citations91
US6603195B1Aug 5, 2003
Planarized plastic package modules for integrated circuits
IBM15 citations79
US6649833B1Nov 18, 2003
Negative volume expansion lead-free electrical connection
IBM12 citations73
US6433283B2Aug 13, 2002
Dual purpose ribbon cable
IBM7 citations73
US6268567B1Jul 31, 2001
Dual purpose ribbon cable
IBM9 citations73
US6672500B2Jan 6, 2004
Method for producing a reliable solder joint interconnection
IBM10 citations72
US6293455B1Sep 25, 2001
Method for producing a reliable BGA solder joint interconnection
IBM4 citations61
US7499614B2Mar 3, 2009
Passive alignment of VCSELs to waveguides in opto-electronic cards and printed circuit boards
IBM0 citations42
ENDICOTT INTERCONNECT TECH INC
4 patentsUS7510912B2Mar 31, 2009
Method of making wirebond electronic package with enhanced chip pad design
ENDICOTT INTERCONNECT TECH INC17 citations92
US7875811B2Jan 25, 2011
High speed interposer
ENDICOTT INTERCONNECT TECH INC4 citations63
US7629541B2Dec 8, 2009
High speed interposer
ENDICOTT INTERCONNECT TECH INC4 citations63
US7253518B2Aug 7, 2007
Wirebond electronic package with enhanced chip pad design, method of making same, and information handling system utilizing same
ENDICOTT INTERCONNECT TECH INC2 citations62