Inventor
INFANTOLINO WILLIAM
US10 patents
Patents
10 patentsUS6759270B2Jul 6, 2004
Semiconductor chip module and method of manufacture of same
IBM23 citations92
US6756662B2Jun 29, 2004
Semiconductor chip module and method of manufacture of same
IBM19 citations92
US6747331B2Jun 8, 2004
Method and packaging structure for optimizing warpage of flip chip organic packages
IBM13 citations83
US6967389B2Nov 22, 2005
Wafer with semiconductor chips mounted thereon
IBM4 citations73
US6433283B2Aug 13, 2002
Dual purpose ribbon cable
IBM7 citations73
US6268567B1Jul 31, 2001
Dual purpose ribbon cable
IBM9 citations73
US7088008B2Aug 8, 2006
Electronic package with optimized circuitization pattern
IBM4 citations62
US7026706B2Apr 11, 2006
Method and packaging structure for optimizing warpage of flip chip organic packages
IBM3 citations62
US6905961B2Jun 14, 2005
Land grid array stiffener for use with flexible chip carriers
IBM2 citations62
US6014031AJan 11, 2000
Apparatus for pressing an electronic card against contacts of a test socket
IBM1 citations50