Inventor

BENEDIKT MICHAEL

DE3 patents

⚠️ This page may combine multiple inventors who share the name “BENEDIKT MICHAEL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HERAEUS DEUTSCHLAND GMBH & CO KG

2 patents

US10347566B2Jul 9, 2019

Carrier and clip each having sinterable, solidified paste for connection to a semiconductor element, corresponding sintering paste, and corresponding production method and use

HERAEUS DEUTSCHLAND GMBH & CO KG0 citations47

US9941197B2Apr 10, 2018

Strip-shaped substrate for producing chip carriers, electronic module with a chip carrier of this type, electronic device with a module of this type, and method for producing a substrate

HERAEUS DEUTSCHLAND GMBH & CO KG0 citations47

OSRAM GMBH

1 patent

US10468569B2Nov 5, 2019

Method of producing a connection support, connection support and optoelectronic semiconductor component comprising a connection support

OSRAM GMBH0 citations43