Inventor
HISHIKI KAORU
JP15 patents
⚠️ This page may combine multiple inventors who share the name “HISHIKI KAORU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
OHKUCHI MAT CO LTD
12 patentsUS10903150B2Jan 26, 2021
Lead frame
OHKUCHI MAT CO LTD3 citations70
US10847451B2Nov 24, 2020
Device for mounting semiconductor element, lead frame, and substrate for mounting semiconductor element
OHKUCHI MAT CO LTD4 citations70
US10777492B1Sep 15, 2020
Substrate for mounting semiconductor element
OHKUCHI MAT CO LTD3 citations70
US10312187B2Jun 4, 2019
Multi-row wiring member for semiconductor device and method for manufacturing the same
OHKUCHI MAT CO LTD2 citations68
US11404286B2Aug 2, 2022
Lead frame
OHKUCHI MAT CO LTD0 citations59
US11062983B2Jul 13, 2021
Substrate for mounting semiconductor element
OHKUCHI MAT CO LTD1 citations59
US10811346B2Oct 20, 2020
Lead frame
OHKUCHI MAT CO LTD0 citations49
US10763196B1Sep 1, 2020
Lead frame
OHKUCHI MAT CO LTD0 citations49
US10763202B2Sep 1, 2020
Multi-row wiring member for semiconductor device and method for manufacturing the same
OHKUCHI MAT CO LTD0 citations36
US10453782B2Oct 22, 2019
Multi-row wiring member for semiconductor device and method for manufacturing the same
OHKUCHI MAT CO LTD0 citations36
US10727171B2Jul 28, 2020
Lead frame
OHKUCHI MAT CO LTD0 citations33
US10305007B2May 28, 2019
Multi-row LED wiring member and method for manufacturing the same
OHKUCHI MAT CO LTD0 citations30
SH MATERIALS CO LTD
3 patentsUS9735096B1Aug 15, 2017
Lead frame and method for manufacturing the same
SH MATERIALS CO LTD3 citations62
US9735106B2Aug 15, 2017
Semiconductor lead frame, semiconductor package, and manufacturing method thereof
SH MATERIALS CO LTD1 citations46
US9870930B2Jan 16, 2018
Method for producing substrate for mounting semiconductor element
SH MATERIALS CO LTD0 citations34