Inventor
JUNG JUNG LAE
KR6 patents
Patents
6 patentsUS10410990B2Sep 10, 2019
Jig for bonding a semiconductor chip, apparatus for bonding a semiconductor chip including the jig, and method of bonding a semiconductor chip using the apparatus
SAMSUNG ELECTRONICS CO LTD6 citations81
US10900883B2Jan 26, 2021
Mold test apparatus and method
SAMSUNG ELECTRONICS CO LTD0 citations57
US10748855B2Aug 18, 2020
Laminating device and method for fabricating semiconductor package using the same
SAMSUNG ELECTRONICS CO LTD1 citations57
US10741430B2Aug 11, 2020
Stack boat tool and method using the same
SAMSUNG ELECTRONICS CO LTD0 citations47
US11244840B2Feb 8, 2022
Die ejectors and die supplying apparatuses including ihe same
SAMSUNG ELECTRONICS CO LTD0 citations43
US10833046B2Nov 10, 2020
Stack tool for reflow and stack apparatus having the same
SAMSUNG ELECTRONICS CO LTD0 citations43