Inventor
NAKATA YASUKAZU
JP14 patents
⚠️ This page may combine multiple inventors who share the name “NAKATA YASUKAZU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LINTEC CORP
13 patentsUS6277481B1Aug 21, 2001
Adhesive composition and adhesive sheet
LINTEC CORP74 citations96
US6765289B2Jul 20, 2004
Reinforcement material for silicon wafer and process for producing IC chip using said material
LINTEC CORP27 citations92
US6853286B2Feb 8, 2005
Flat coil component, characteristic adjusting method of flat coil component, ID tag, and characteristic adjusting method of ID tag
LINTEC CORP30 citations91
US7626548B2Dec 1, 2009
Antenna circuit, IC inlet and IC tag
LINTEC CORP20 citations90
US6495752B1Dec 17, 2002
Electric wave shielding material
LINTEC CORP12 citations73
US6369773B2Apr 9, 2002
Sheet antenna
LINTEC CORP8 citations72
US7397672B2Jul 8, 2008
Flip chip mounting substrate
LINTEC CORP2 citations62
US6592973B1Jul 15, 2003
Card and process for producing the card
LINTEC CORP6 citations62
US7294917B2Nov 13, 2007
IC tag
LINTEC CORP3 citations59
US7812248B2Oct 12, 2010
Light transmissible solar cell module, process for manufacturing same, and solar cell panel thereof
LINTEC CORP1 citations51
US7804021B2Sep 28, 2010
Light transmissible solar cell module, process for manufacturing same, and solar cell panel thereof
LINTEC CORP0 citations51
US10174234B2Jan 8, 2019
Adhesive composition and adhesive sheet
LINTEC CORP0 citations40
US6927099B2Aug 9, 2005
Process for producing semiconductor device and semiconductor device
LINTEC CORP0 citations39