Inventor

MA HANG-SHING

US3 patents

⚠️ This page may combine multiple inventors who share the name “MA HANG-SHING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE KEVIN J

2 patents

US9142510B2Sep 22, 2015

3D interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approach

LEE KEVIN J17 citations90

US9449913B2Sep 20, 2016

3D interconnect structure comprising fine pitch single damascene backside metal redistribution lines combined with through-silicon vias

LEE KEVIN J18 citations82

INTEL CORP

1 patent

US9530740B2Dec 27, 2016

3D interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approach

INTEL CORP0 citations50