P

Inventor

KAL SUBHADEEP

US31 patents

Patents

31 patents
US10833078B2Nov 10, 2020

Semiconductor apparatus having stacked gates and method of manufacture thereof

TOKYO ELECTRON LTD34 citations94
US10685887B2Jun 16, 2020

Method for incorporating multiple channel materials in a complimentary field effective transistor (CFET) device

TOKYO ELECTRON LTD26 citations94
US9997598B2Jun 12, 2018

Three-dimensional semiconductor device and method of fabrication

TOKYO ELECTRON LTD26 citations94
US10714391B2Jul 14, 2020

Method for controlling transistor delay of nanowire or nanosheet transistor devices

TOKYO ELECTRON LTD11 citations86
US10991626B2Apr 27, 2021

Method for controlling transistor delay of nanowire or nanosheet transistor devices

TOKYO ELECTRON LTD6 citations84
US10378105B2Aug 13, 2019

Selective deposition with surface treatment

TOKYO ELECTRON LTD12 citations83
US11631671B2Apr 18, 2023

3D complementary metal oxide semiconductor (CMOS) device and method of forming the same

TOKYO ELECTRON LTD5 citations75
US11264274B2Mar 1, 2022

Reverse contact and silicide process for three-dimensional logic devices

TOKYO ELECTRON LTD5 citations73
US10923356B2Feb 16, 2021

Gas phase etch with controllable etch selectivity of silicon-germanium alloys

TOKYO ELECTRON LTD2 citations73
US9984890B2May 29, 2018

Isotropic silicon and silicon-germanium etching with tunable selectivity

TOKYO ELECTRON LTD6 citations73
US9748110B2Aug 29, 2017

Method and system for selective spacer etch for multi-patterning schemes

TOKYO ELECTRON LTD4 citations72
US10971372B2Apr 6, 2021

Gas phase etch with controllable etch selectivity of Si-containing arc or silicon oxynitride to different films or masks

TOKYO ELECTRON LTD2 citations71
US10573564B2Feb 25, 2020

Method for fabricating NFET and PFET nanowire devices

TOKYO ELECTRON LTD5 citations69
US12336274B2Jun 17, 2025

Self-aligned method for vertical recess for 3D device integration

TOKYO ELECTRON LTD1 citations64
US11444082B2Sep 13, 2022

Semiconductor apparatus having stacked gates and method of manufacture thereof

TOKYO ELECTRON LTD1 citations62
US11424123B2Aug 23, 2022

Forming a semiconductor feature using atomic layer etch

TOKYO ELECTRON LTD1 citations62
US11322350B2May 3, 2022

Non-plasma etch of titanium-containing material layers with tunable selectivity to alternate metals and dielectrics

TOKYO ELECTRON LTD0 citations62
US11538691B2Dec 27, 2022

Gas phase etch with controllable etch selectivity of Si-containing arc or silicon oxynitride to different films or masks

TOKYO ELECTRON LTD0 citations61
US11380554B2Jul 5, 2022

Gas phase etching system and method

TOKYO ELECTRON LTD0 citations61
US11715643B2Aug 1, 2023

Gas phase etch with controllable etch selectivity of metals

TOKYO ELECTRON LTD0 citations60
US11322401B2May 3, 2022

Reverse contact and silicide process for three-dimensional semiconductor devices

TOKYO ELECTRON LTD1 citations60
US12593634B2Mar 31, 2026

Selective gas phase etch of silicon germanium alloys

TOKYO ELECTRON LTD0 citations58
US12261053B2Mar 25, 2025

Substrate processing with selective etching

TOKYO ELECTRON LTD0 citations57
US12444614B2Oct 14, 2025

Etch selectivity modulation by fluorocarbon treatment

TOKYO ELECTRON LTD0 citations54
US12568651B2Mar 3, 2026

Semiconductor structure having stacked gates and method of manufacture thereof

TOKYO ELECTRON LTD0 citations52
US12568677B2Mar 3, 2026

Method of self-aligned dielectric wall formation for forksheet application

TOKYO ELECTRON LTD0 citations51
US11557479B2Jan 17, 2023

Methods for EUV inverse patterning in processing of microelectronic workpieces

TOKYO ELECTRON LTD0 citations51
US10580660B2Mar 3, 2020

Gas phase etching system and method

TOKYO ELECTRON LTD0 citations51
US12512327B2Dec 30, 2025

Surface modification to achieve selective isotropic etch

TOKYO ELECTRON LTD0 citations47
US12272558B2Apr 8, 2025

Selective and isotropic etch of silicon over silicon-germanium alloys and dielectrics; via new chemistry and surface modification

TOKYO ELECTRON LTD0 citations47
US12261054B2Mar 25, 2025

Substrate processing with material modification and removal

TOKYO ELECTRON LTD0 citations47