Inventor

LEE KEVIN J

US53 patents

⚠️ This page may combine multiple inventors who share the name “LEE KEVIN J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE KEVIN J

INTEL CORP

Capping copper bumps

Methods of processing thick ILD layers using spray coating or lamination for C4 wafer level thick metal integrated flow

Chemical-mechanical polishing slurry

Logic chip including embedded magnetic tunnel junctions

Chemical-mechanical polishing slurry

Chemical-mechanical polishing slurry

Single step electroplating process for interconnect via fill and metal line patterning

Single step electroplating process for interconnect via fill and metal line patterning

Under bump metallization layer to enable use of high tin content solder bumps

Damascene-based approaches for embedding spin hall MTJ devices into a logic processor and the resulting structures

Forming thick metal interconnect structures for integrated circuits

Wafer stacking with anisotropic conductive adhesive

Method and apparatus for forming backside die planar devices and saw filter

Logic chip including embedded magnetic tunnel junctions

Logic chip including embedded magnetic tunnel junctions

Dual layer dielectric stack for microelectronics having thick metal lines

Interconnect structure comprising fine pitch backside metal redistribution lines combined with vias

Buffer coating having a physical mixture of high toughness polymer and a low shrinkage polymer

Electroplating cell based upon rotational plating solution flow

Approaches for embedding spin hall MTJ devices into a logic processor and the resulting structures

Techniques for forming logic including integrated spin-transfer torque magnetoresistive random-access memory

Integrated circuit die having backside passive components and methods associated therewith

Logic chip including embedded magnetic tunnel junctions

Through-body-via isolated coaxial capacitor and techniques for forming same

Preservation of fine pitch redistribution lines

Integrated circuit die having backside passive components and methods associated therewith

Method for handling very thin device wafers

Solder limiting layer for integrated circuit die copper bumps

Multi-layer thick metallization structure for a microelectronic device, intergrated circuit containing same, and method of manufacturing an integrated circuit containing same

Method and apparatus for forming backside die planar devices and saw filter

Composite photoresist for modifying die-side bumps

Method for constructing contact formations

Through-body via formation techniques

Controlled potential anodic etching process for the selective removal of conductive thin films

3D interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approach

LEE KEVIN J

3D interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approach

Masking content while preserving layout of a webpage

Multipurpose ball joint assembly and work holding devices

3D interconnect structure comprising fine pitch single damascene backside metal redistribution lines combined with through-silicon vias

Structure having a planar bonding surface

Work holding device for an archery bow

SENTISEARCH INC

Nucleic acids and proteins of insect Or83b odorant receptor genes and uses thereof

Nucleic acids and proteins of insect Or83b odorant receptor genes and uses thereof

Nucleic acids and proteins of insect Or83b odorant receptor genes and uses thereof

LONGYEAR CO

Drilling latch apparatus

UNIV COLUMBIA

Method for assaying protein—protein interaction

PAK POY & KNEEBONE PTY LTD

Motor racing track fence

LIFE TECHNOLOGIES CORP

Method for assaying protein-protein interaction

HE JUN

Selective removal of on-die redistribution interconnects from scribe-lines

PELTO CHRISTOPHER M

Landing structure for through-silicon via