Inventor

CHUNG HSIU-HSIN

US4 patents

⚠️ This page may combine multiple inventors who share the name “CHUNG HSIU-HSIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WINBOND ELECTRONICS CORP

2 patents

US6002179ADec 14, 1999

Bonding pad structure for integrated circuit (I)

WINBOND ELECTRONICS CORP30 citations88

US5962919AOct 5, 1999

Bonding pad structure for integrated circuit (III)

WINBOND ELECTRONICS CORP28 citations86

MEDTRONIC MINIMED INC

2 patents

US12372490B2Jul 29, 2025

Structurally reinforced sensor and method for manufacturing the same

MEDTRONIC MINIMED INC0 citations53

US11448611B2Sep 20, 2022

Structurally reinforced sensor and method for manufacturing the same

MEDTRONIC MINIMED INC0 citations53