Inventor

LOPATIN SERGEY

US77 patents

⚠️ This page may combine multiple inventors who share the name “LOPATIN SERGEY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LOPATIN SERGEY

ADVANCED MICRO DEVICES INC

Semiconductor device with copper-filled via includes a copper-zinc/alloy film for reduced electromigration of copper

Superconducting damascene interconnected for integrated circuit

Method of forming Cu-Ca-O thin films on Cu surfaces in a chemical solution and semiconductor device thereby formed

Method for filling a dual damascene opening having high aspect ratio to minimize electromigration failure

Method of forming copper/copper alloy interconnection with reduced electromigration

Method of electrochemical formation of high Tc superconducting damascene interconnect for integrated circuit

Interconnect structure formed in porous dielectric material with minimized degradation and electromigration

Formation of alloy material using alternating depositions of alloy doping element and bulk material

Method of reducing electromigration by ordering zinc-doping in an electroplated copper-zinc interconnect and a semiconductor device thereby formed

Method of porous dielectric formation with anodic template

Method of fabricating improved copper metallization including forming and removing passivation layer before forming capping film

Method of electroless ag layer formation for cu interconnects

Method of improving Cu damascene interconnect reliability by laser anneal before barrier polish

Method of forming an alloy precipitate to surround interconnect to minimize electromigration

Selective deposition process for allowing damascene-type Cu interconnect lines

Tin palladium activation with maximized nuclei density and uniformity on barrier material in interconnect structure

Method of copper-polysilicon T-gate formation

Formation without vacuum break of sacrificial layer that dissolves in acidic activation solution within interconnect

Method of re-working copper damascene wafers

Selective deposition process for passivating top interface of damascene-type Cu interconnect lines

Method of copper-polysilicon gate formation

Tantalum anodization for in-laid copper metallization capacitor

Method of reducing electromigration in copper lines by forming an interim layer of calcium-doped copper seed layer in a chemical solution and semiconductor device thereby formed

Method for removing copper residue from surfaces of a semiconductor wafer

Fabrication of a via plug having high aspect ratio with a diffusion barrier layer effectively surrounding the via plug

Scaled interconnect anodization for high frequency applications

Method of reducing electromigration by forming an electroplated copper-zinc interconnect and a semiconductor device thereby formed

Method of reducing electromigration in a copper line by electroplating an interim copper-zinc alloy thin film on a copper surface and a semiconductor device thereby formed

Method of reducing electromigration in a copper line by Zinc-Doping of a copper surface from an electroplated copper-zinc alloy thin film and a semiconductor device thereby formed

Depositing an adhesion skin layer and a conformal seed layer to fill an interconnect opening

Minimizing resistance and electromigration of interconnect by adjusting anneal temperature and amount of seed layer dopant

Chemical solution for electroplating a copper-zinc alloy thin film

Semiconductor component and method of manufacture

Semiconductor device having copper lines with reduced electromigration using an electroplated interim copper-zinc alloy film on a copper surface

Semiconductor device having reduced electromigration in copper lines with calcium-doped copper surfaces formed by using a chemical solution

Method of reducing electromigration in copper lines by calcium-doping copper surfaces in a chemical solution

Semiconductor device fabricated by a method of reducing electromigration in copper lines by forming an interim layer of calcium-doped copper seed layer in a chemical solution

Tin palladium activation with maximized nuclei density and uniformity on barrier material in interconnect structure

APPLIED MATERIALS INC

Apparatus for electroless deposition

High-aspect ratio anode and apparatus for high-speed electroplating on a solar cell substrate

Pretreatment for electroless deposition

Method for forming CoWRe alloys by electroless deposition

Apparatus and method of detecting the electroless deposition endpoint

Wafer cleaning solution for cobalt electroless application

Electroplating on roll-to-roll flexible solar cell substrates

ENDRESS HAUSER GMBH CO

Method of operating an ultransonic piezoelectric transducer and circuit arrangement for performing the method

(unassigned)

Method for making multilayered coaxial interconnect structure

AMD

Copper/low dielectric interconnect formation with reduced electromigration

ADVANCED MICRO DEVICE

Method of metal/polysilicon gate formation in a field effect transistor

KLA TENCOR TECH CORP

Etch selectivity enhancement in electron beam activated chemical etch