Inventor
LUTHER BARBARA
US4 patents
Patents
4 patentsUS4789648ADec 6, 1988
Method for producing coplanar multi-level metal/insulator films on a substrate and for forming patterned conductive lines simultaneously with stud vias
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Plasma treatment to enhance inorganic dielectric adhesion to copper
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Plasma treatment to enhance inorganic dielectric adhesion to copper
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US6593660B2Jul 15, 2003
Plasma treatment to enhance inorganic dielectric adhesion to copper
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