Inventor

ODASHIMA TEIKOU

JP2 patents

⚠️ This page may combine multiple inventors who share the name “ODASHIMA TEIKOU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TOSHIBA KK

1 patent

US5998243ADec 7, 1999

Method for manufacturing semiconductor device and apparatus for resin-encapsulating

TOSHIBA KK137 citations95

TOWA CORP

1 patent

US6436331B1Aug 20, 2002

Method of resin sealing a gap between a semiconductor chip and a substrate

TOWA CORP13 citations71