Inventor

YU CHEN SHIH

TW2 patents

Patents

2 patents

US6680531B2Jan 20, 2004

Multi-chip semiconductor package

SILICONWARE PRECISION INDUSTRIES CO LTD13 citations78

US6809408B2Oct 26, 2004

Semiconductor package with die pad having recessed portion

SILICONWARE PRECISION INDUSTRIES CO LTD10 citations63