Inventor
LIU WUPING
SG16 patents
⚠️ This page may combine multiple inventors who share the name “LIU WUPING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CHARTERED SEMICONDUCTOR MFG
11 patentsUS7601607B2Oct 13, 2009
Protruded contact and insertion of inter-layer-dielectric material to match damascene hardmask to improve undercut for low-k interconnects
CHARTERED SEMICONDUCTOR MFG8 citations80
US7012022B2Mar 14, 2006
Self-patterning of photo-active dielectric materials for interconnect isolation
CHARTERED SEMICONDUCTOR MFG7 citations73
US6995087B2Feb 7, 2006
Integrated circuit with simultaneous fabrication of dual damascene via and trench
CHARTERED SEMICONDUCTOR MFG4 citations62
US6967156B2Nov 22, 2005
Method to fabricate aligned dual damascene openings
CHARTERED SEMICONDUCTOR MFG3 citations62
US7276440B2Oct 2, 2007
Method of fabrication of a die oxide ring
CHARTERED SEMICONDUCTOR MFG2 citations61
US7153766B2Dec 26, 2006
Metal barrier cap fabrication by polymer lift-off
CHARTERED SEMICONDUCTOR MFG4 citations61
US7678586B2Mar 16, 2010
Structure and method to prevent charge damage from e-beam curing process
CHARTERED SEMICONDUCTOR MFG0 citations52
US7615484B2Nov 10, 2009
Integrated circuit manufacturing method using hard mask
CHARTERED SEMICONDUCTOR MFG0 citations52
US7372156B2May 13, 2008
Method to fabricate aligned dual damascene openings
CHARTERED SEMICONDUCTOR MFG0 citations51
US7323408B2Jan 29, 2008
Metal barrier cap fabrication by polymer lift-off
CHARTERED SEMICONDUCTOR MFG0 citations51
US7256136B2Aug 14, 2007
Self-patterning of photo-active dielectric materials for interconnect isolation
CHARTERED SEMICONDUCTOR MFG0 citations51
GLOBALFOUNDRIES SG PTE LTD
4 patentsUS8358007B2Jan 22, 2013
Integrated circuit system employing low-k dielectrics and method of manufacture thereof
GLOBALFOUNDRIES SG PTE LTD18 citations82
US9443761B2Sep 13, 2016
Methods for fabricating integrated circuits having device contacts
GLOBALFOUNDRIES SG PTE LTD4 citations71
US8018061B2Sep 13, 2011
Integrated circuit hard mask processing system
GLOBALFOUNDRIES SG PTE LTD0 citations52
US7906426B2Mar 15, 2011
Method of controlled low-k via etch for Cu interconnections
GLOBALFOUNDRIES SG PTE LTD0 citations45