Inventor
FAN FU-JIER
TW49 patents
⚠️ This page may combine multiple inventors who share the name “FAN FU-JIER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
28 patentsUS10050033B1Aug 14, 2018
High voltage integration for HKMG technology
TAIWAN SEMICONDUCTOR MFG CO LTD18 citations94
US11410995B1Aug 9, 2022
Semiconductor structure and method of forming thereof
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations85
US11063038B2Jul 13, 2021
Through silicon via design for stacking integrated circuits
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US10964692B2Mar 30, 2021
Through silicon via design for stacking integrated circuits
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10629592B2Apr 21, 2020
Through silicon via design for stacking integrated circuits
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US10516029B2Dec 24, 2019
Dishing prevention dummy structures for semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US10340357B2Jul 2, 2019
Dishing prevention dummy structures for semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations84
US11705449B2Jul 18, 2023
Through silicon via design for stacking integrated circuits
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11302691B2Apr 12, 2022
High voltage integration for HKMG technology
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10950708B2Mar 16, 2021
Dishing prevention dummy structures for semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10790279B2Sep 29, 2020
High voltage integration for HKMG technology
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10510750B2Dec 17, 2019
High voltage integration for HKMG technology
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US9853149B1Dec 26, 2017
Floating grid and crown-shaping poly for improving ILD CMP dishing
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10937785B2Mar 2, 2021
Semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US12500193B2Dec 16, 2025
Semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations64
US11646308B2May 9, 2023
Through silicon via design for stacking integrated circuits
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12100706B2Sep 24, 2024
Semiconductor structure and method of forming thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11710712B2Jul 25, 2023
Semiconductor device and manufacturing method of the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11569363B2Jan 31, 2023
Dishing prevention dummy structures for semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10937891B2Mar 2, 2021
Spacer structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11417649B2Aug 16, 2022
Semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11004844B2May 11, 2021
Recessed STI as the gate dielectric of HV device
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations61
US10916542B2Feb 9, 2021
Recessed STI as the gate dielectric of HV device
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations61
US12272686B2Apr 8, 2025
Semiconductor structure and manufacturing method of the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10868141B2Dec 15, 2020
Spacer structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US12414361B2Sep 9, 2025
Method of manufacturing a semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10325964B2Jun 18, 2019
OLED merged spacer device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations39
US10164037B2Dec 25, 2018
Semiconductor device structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations39
TAIWAN SEMICONDUCTOR MFG
20 patentsUS6605524B1Aug 12, 2003
Bumping process to increase bump height and to create a more robust bump structure
TAIWAN SEMICONDUCTOR MFG78 citations98
US6482669B1Nov 19, 2002
Colors only process to reduce package yield loss
TAIWAN SEMICONDUCTOR MFG81 citations98
US6426281B1Jul 30, 2002
Method to form bump in bumping technology
TAIWAN SEMICONDUCTOR MFG147 citations98
US6586323B1Jul 1, 2003
Method for dual-layer polyimide processing on bumping technology
TAIWAN SEMICONDUCTOR MFG76 citations97
US6632700B1Oct 14, 2003
Method to form a color image sensor cell while protecting the bonding pad structure from damage
TAIWAN SEMICONDUCTOR MFG58 citations96
US6956292B2Oct 18, 2005
Bumping process to increase bump height and to create a more robust bump structure
TAIWAN SEMICONDUCTOR MFG37 citations92
US6936923B2Aug 30, 2005
Method to form very a fine pitch solder bump using methods of electroplating
TAIWAN SEMICONDUCTOR MFG23 citations92
US6876049B2Apr 5, 2005
Colors only process to reduce package yield loss
TAIWAN SEMICONDUCTOR MFG12 citations92
US6649507B1Nov 18, 2003
Dual layer photoresist method for fabricating a mushroom bumping plating structure
TAIWAN SEMICONDUCTOR MFG33 citations92
US6583039B2Jun 24, 2003
Method of forming a bump on a copper pad
TAIWAN SEMICONDUCTOR MFG37 citations92
US6372545B1Apr 16, 2002
Method for under bump metal patterning of bumping process
TAIWAN SEMICONDUCTOR MFG22 citations92
US6958546B2Oct 25, 2005
Method for dual-layer polyimide processing on bumping technology
TAIWAN SEMICONDUCTOR MFG45 citations90
US7183598B2Feb 27, 2007
Colors only process to reduce package yield loss
TAIWAN SEMICONDUCTOR MFG10 citations84
US7323784B2Jan 29, 2008
Top via pattern for bond pad structure
TAIWAN SEMICONDUCTOR MFG14 citations82
US6426283B1Jul 30, 2002
Method for bumping and backlapping a semiconductor wafer
TAIWAN SEMICONDUCTOR MFG10 citations74
US7816169B2Oct 19, 2010
Colors only process to reduce package yield loss
TAIWAN SEMICONDUCTOR MFG5 citations73
US7485906B2Feb 3, 2009
Colors only process to reduce package yield loss
TAIWAN SEMICONDUCTOR MFG2 citations63
US8049295B2Nov 1, 2011
Coupling well structure for improving HVMOS performance
TAIWAN SEMICONDUCTOR MFG2 citations62
US9111957B2Aug 18, 2015
Coupling well structure for improving HVMOS performance
TAIWAN SEMICONDUCTOR MFG0 citations51
US7816214B2Oct 19, 2010
Coupling well structure for improving HVMOS performance
TAIWAN SEMICONDUCTOR MFG0 citations51