Inventor
HWANG SONKWAN
KR3 patents
Patents
3 patentsUS11749586B2Sep 5, 2023
Semiconductor device including through via structure
SAMSUNG ELECTRONICS CO LTD3 citations71
US12046538B2Jul 23, 2024
Semiconductor device including through via structure
SAMSUNG ELECTRONICS CO LTD0 citations60
US12166000B2Dec 10, 2024
Semiconductor device including a lower chip including a peripheral circuit and first and second memory chips vertically stacked thereon and data storage system including the same
SAMSUNG ELECTRONICS CO LTD0 citations43