Inventor
FUJIKATA JUMPEI
JP57 patents
⚠️ This page may combine multiple inventors who share the name “FUJIKATA JUMPEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
EBARA CORP
43 patentsUSRE45687ESep 29, 2015
Plating apparatus and plating method
EBARA CORP14 citations91
USD758973SJun 14, 2016
Electrical contact for use in a plating apparatus
EBARA CORP9 citations84
USD742329SNov 3, 2015
Electrical contact for use in a plating apparatus
EBARA CORP7 citations84
USD725600SMar 31, 2015
Electrical contact for use in a plating apparatus
EBARA CORP10 citations84
USD705280SMay 20, 2014
Sealing ring
EBARA CORP8 citations84
USD892747SAug 11, 2020
Electrical contact
EBARA CORP3 citations73
USD884650SMay 19, 2020
Electrical contact
EBARA CORP4 citations73
US10633757B2Apr 28, 2020
Plating apparatus, plating method, and recording medium
EBARA CORP3 citations73
US10577713B2Mar 3, 2020
Substrate holder, plating apparatus, and method for manufacturing substrate holder
EBARA CORP4 citations73
US10273594B2Apr 30, 2019
Plating apparatus, substrate holder, plating apparatus controlling method, and storage medium configured to store program for instructing computer to implement plating apparatus controlling method
EBARA CORP2 citations73
US9972510B2May 15, 2018
Substrate cleaning apparatus and substrate cleaning method
EBARA CORP2 citations73
US10641677B2May 5, 2020
Plating method and plating apparatus
EBARA CORP3 citations72
US10309030B2Jun 4, 2019
Plating method and plating apparatus
EBARA CORP2 citations72
US11315812B2Apr 26, 2022
Semiconductor manufacturing apparatus, failure prediction method for semiconductor manufacturing apparatus, and failure prediction program for semiconductor manufacturing apparatus
EBARA CORP5 citations71
US11604150B2Mar 14, 2023
Device for measuring bump height, apparatus for processing substrate, method of measuring bump height, and storage medium
EBARA CORP2 citations70
US11686647B2Jun 27, 2023
Leak check method, leak check apparatus, plating method, and plating apparatus
EBARA CORP0 citations63
US11385125B2Jul 12, 2022
Leak check method, leak check apparatus, plating method, and plating apparatus
EBARA CORP0 citations63
US12116687B2Oct 15, 2024
Powder supply apparatus and plating system
EBARA CORP0 citations62
US11891715B2Feb 6, 2024
Paddle, processing apparatus having the paddle, and method of producing the paddle
EBARA CORP0 citations62
US11359304B2Jun 14, 2022
Powder supply apparatus and plating system
EBARA CORP0 citations62
US11230789B2Jan 25, 2022
Method of removing liquid from seal of a substrate holder
EBARA CORP0 citations62
US11047063B2Jun 29, 2021
Plating apparatus and plating method
EBARA CORP0 citations62
US10914020B2Feb 9, 2021
Wave absorbing member attachable to paddle and plating apparatus including wave absorbing member
EBARA CORP0 citations62
US9611563B2Apr 4, 2017
Plating method and plating apparatus
EBARA CORP1 citations62
US9340891B2May 17, 2016
Plating method and plating apparatus
EBARA CORP2 citations62
US12191178B2Jan 7, 2025
Semiconductor manufacturing apparatus, failure prediction method for semiconductor manufacturing apparatus, and failure prediction program for semiconductor manufacturing apparatus
EBARA CORP0 citations60
US11717796B2Aug 8, 2023
Paddle, plating apparatus equipped with the paddle, and plating method
EBARA CORP0 citations60
US10946351B2Mar 16, 2021
Paddle, plating apparatus equipped with the paddle, and plating method
EBARA CORP0 citations60
US10910334B2Feb 2, 2021
Device for inspecting a bump height surrounded by resist, device for processing a substrate, method for inspecting a bump height, and storage medium
EBARA CORP0 citations59
US11371155B2Jun 28, 2022
Method and apparatus for processing a substrate
EBARA CORP0 citations58
US11447885B2Sep 20, 2022
Plating method and plating apparatus
EBARA CORP0 citations55
US11535949B2Dec 27, 2022
Substrate holder and plating apparatus
EBARA CORP0 citations52
US10954603B2Mar 23, 2021
Substrate holder, plating apparatus, plating method, and electric contact
EBARA CORP0 citations52
US10533262B2Jan 14, 2020
Plating apparatus, substrate holder, plating apparatus controlling method, and storage medium configured to store program for instructing computer to implement plating apparatus controlling method
EBARA CORP0 citations52
US10487415B2Nov 26, 2019
Method of adjusting plating apparatus, and measuring apparatus
EBARA CORP0 citations52
US10119198B2Nov 6, 2018
Method of cleaning substrate holder
EBARA CORP0 citations52
US10100424B2Oct 16, 2018
Method of adjusting plating apparatus, and measuring apparatus
EBARA CORP1 citations52
US9376760B2Jun 28, 2016
Plating apparatus and method of cleaning substrate holder
EBARA CORP0 citations52
US10914019B2Feb 9, 2021
Plating apparatus and plating method
EBARA CORP0 citations51
US10676838B2Jun 9, 2020
Plating device, plating method, substrate holder, resistance measuring module, and substrate holder testing method
EBARA CORP0 citations51
US10294578B2May 21, 2019
Plating apparatus and plating method
EBARA CORP0 citations51
US10113246B2Oct 30, 2018
Substrate holder, plating apparatus, and plating method
EBARA CORP0 citations51
US10508352B2Dec 17, 2019
Method and apparatus for processing a substrate
EBARA CORP0 citations48
FUJIKATA JUMPEI
5 patentsUSD649986SDec 6, 2011
Sealing ring
FUJIKATA JUMPEI438 citations98
USD659175SMay 8, 2012
Sealing ring
FUJIKATA JUMPEI21 citations92
USD669439SOct 23, 2012
Electrical contact
FUJIKATA JUMPEI15 citations84
USD651178SDec 27, 2011
Electrical contact for use in a plating apparatus
FUJIKATA JUMPEI15 citations84
US8864965B2Oct 21, 2014
Substrate holder and plating apparatus
FUJIKATA JUMPEI3 citations62
SAITO NOBUTOSHI
2 patentsShowing the top 50 of 57 patents by PatentIndex Score.