Inventor
LAUDICK DAVID A
US8 patents
Patents
8 patentsUS7739791B2Jun 22, 2010
Method of producing an overmolded electronic module with a flexible circuit pigtail
DELPHI TECH INC55 citations93
US7473585B2Jan 6, 2009
Technique for manufacturing an overmolded electronic assembly
DELPHI TECH INC19 citations83
US7510108B2Mar 31, 2009
Method of making an electronic assembly
DELPHI TECH INC19 citations82
US7230829B2Jun 12, 2007
Overmolded electronic assembly with insert molded heat sinks
DELPHI TECH INC17 citations82
US6905349B1Jun 14, 2005
Technique for connector to printed circuit board decoupling to eliminate flexure
DELPHI TECH INC11 citations73
US7603770B2Oct 20, 2009
Method of overmolding an electronic assembly having an insert-molded vertical mount connector header
DELPHI TECH INC3 citations62
US6875636B2Apr 5, 2005
Wafer applied thermally conductive interposer
DELPHI TECH INC2 citations62
US7268429B2Sep 11, 2007
Technique for manufacturing an overmolded electronic assembly
DELPHI TECH INC3 citations61