P

Inventor

CHAN SHU-YEN

TW34 patents
⚠️ This page may combine multiple inventors who share the name “CHAN SHU-YEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

UNITED MICROELECTRONICS CORP

24 patents
US10217750B1Feb 26, 2019

Buried word line structure and method of making the same

UNITED MICROELECTRONICS CORP9 citations83
US9673324B1Jun 6, 2017

MOS device with epitaxial structure associated with source/drain region and method of forming the same

UNITED MICROELECTRONICS CORP14 citations83
US10608093B2Mar 31, 2020

Semiconductor device and method of forming the same

UNITED MICROELECTRONICS CORP2 citations72
US10497704B2Dec 3, 2019

Buried word line structure and method of making the same

UNITED MICROELECTRONICS CORP3 citations72
US9680022B1Jun 13, 2017

Semiconductor device having silicon-germanium layer on fin and method for manufacturing the same

UNITED MICROELECTRONICS CORP2 citations72
US10056288B1Aug 21, 2018

Semiconductor device and fabrication method thereof

UNITED MICROELECTRONICS CORP2 citations71
US7927954B2Apr 19, 2011

Method for fabricating strained-silicon metal-oxide semiconductor transistors

UNITED MICROELECTRONICS CORP2 citations63
US10608086B2Mar 31, 2020

Semiconductor structure with diffusion barrier region and manufacturing method thereof

UNITED MICROELECTRONICS CORP1 citations62
US7435640B2Oct 14, 2008

Method of fabricating gate structure

UNITED MICROELECTRONICS CORP4 citations62
US11502180B2Nov 15, 2022

Semiconductor device and method of forming the same

UNITED MICROELECTRONICS CORP0 citations61
US7811892B2Oct 12, 2010

Multi-step annealing process

UNITED MICROELECTRONICS CORP2 citations60
US11770924B2Sep 26, 2023

Semiconductor device

UNITED MICROELECTRONICS CORP0 citations59
US11631679B2Apr 18, 2023

Semiconductor device

UNITED MICROELECTRONICS CORP0 citations59
US11393826B2Jul 19, 2022

Semiconductor device and method of forming the same

UNITED MICROELECTRONICS CORP0 citations59
US7601404B2Oct 13, 2009

Method for switching decoupled plasma nitridation processes of different doses

UNITED MICROELECTRONICS CORP4 citations59
US9966468B2May 8, 2018

Semiconductor device having reverse U-shaped epitaxial layer and method for fabricating the same

UNITED MICROELECTRONICS CORP0 citations52
US8853740B2Oct 7, 2014

Strained silicon channel semiconductor structure

UNITED MICROELECTRONICS CORP0 citations52
US10847517B2Nov 24, 2020

Method for forming semiconductor device having a multi-thickness gate trench dielectric layer

UNITED MICROELECTRONICS CORP0 citations51
US10373958B2Aug 6, 2019

Semiconductor device having a multi-thickness gate trench dielectric layer

UNITED MICROELECTRONICS CORP0 citations51
US10332889B2Jun 25, 2019

Method of manufacturing a semiconductor device

UNITED MICROELECTRONICS CORP0 citations51
US9899498B2Feb 20, 2018

Semiconductor device having silicon-germanium layer on fin and method for manufacturing the same

UNITED MICROELECTRONICS CORP1 citations51
US8841193B2Sep 23, 2014

Semiconductor structure and method for slimming spacer

UNITED MICROELECTRONICS CORP1 citations51
US7709316B2May 4, 2010

Method of fabricating gate structure

UNITED MICROELECTRONICS CORP0 citations51
US10056388B2Aug 21, 2018

Method for fabricating semiconductor device

UNITED MICROELECTRONICS CORP0 citations49

GUO TED MING-LANG

2 patents

LU TSUO-WEN

2 patents

YANG CHAN-LON

2 patents

CHIEN CHIN-CHENG

1 patent

Wang shao-wei

1 patent

LIN CHIEN-LIANG

1 patent

LIAO CHIN-I

1 patent