Inventor
AMOU SATORU
JP27 patents
⚠️ This page may combine multiple inventors who share the name “AMOU SATORU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI LTD
14 patentsUS6190834B1Feb 20, 2001
Photosensitive resin composition, and multilayer printed circuit board using the same
HITACHI LTD44 citations92
US5914216AJun 22, 1999
Multilayer circuit board and photosensitive resin composition used therefor
HITACHI LTD18 citations92
US7294905B2Nov 13, 2007
Thin film capacitor and electronic circuit component
HITACHI LTD10 citations84
US7193009B2Mar 20, 2007
Electronic device using low dielectric loss tangent insulators for high frequency signals
HITACHI LTD11 citations84
US6756441B2Jun 29, 2004
Low dielectric loss tangent resin composition, curable film and cured product, electrical part using the same and method for production thereof
HITACHI LTD9 citations74
US5565536AOct 15, 1996
Polymerizable compouund, process for producing same and setting composition containing polymerizable compound
HITACHI LTD6 citations74
US6930140B2Aug 16, 2005
Low dielectric loss tangent resin composition, curable film and cured product, electrical part using the same and method for production thereof
HITACHI LTD2 citations63
US6855952B2Feb 15, 2005
Semiconductor device and semiconductor package
HITACHI LTD2 citations63
US5410069AApr 25, 1995
Polymerizable compound, process for producing same and setting composition containing polymerizable compound
HITACHI LTD2 citations63
US5071824ADec 10, 1991
Heat transfer sheet, method for producing it, and method of heat transfer
HITACHI LTD3 citations60
US7375155B2May 20, 2008
Low dielectric loss tangent resin composition, curable film and cured product, electrical part using the same and method for production thereof
HITACHI LTD0 citations52
US7112627B2Sep 26, 2006
Low dielectric loss tangent films and wiring films
HITACHI LTD0 citations52
US6306481B1Oct 23, 2001
Multilayer circuit board having insulating layer with via-holes
HITACHI LTD1 citations51
US9090796B2Jul 28, 2015
Organic-inorganic composite materials containing triazine rings and electrical devices using the same
HITACHI LTD0 citations47
AMOU SATORU
5 patentsUS8115105B2Feb 14, 2012
Prepreg and its application products for low thermal expansion and low dielectric tangent
AMOU SATORU6 citations71
US8420210B2Apr 16, 2013
Resin composition, prepreg, laminate sheet and printed wiring board using the same and method for production thereof
AMOU SATORU2 citations61
US8097545B2Jan 17, 2012
Phase-separation-controlled polybutadiene resin composition and printed wiring board using the resin composition
AMOU SATORU2 citations61
US8227361B2Jul 24, 2012
Prepreg and printed wiring board using thin quartz glass cloth
AMOU SATORU5 citations60
US8507592B2Aug 13, 2013
Adhesive composition, adhesive film and wiring film using the same
AMOU SATORU0 citations51
HITACHI CHEMICAL CO LTD
3 patentsUS7273900B2Sep 25, 2007
Resin composition, prepreg, laminate sheet and printed wiring board using the same and method for production thereof
HITACHI CHEMICAL CO LTD8 citations73
US8685872B2Apr 1, 2014
Low softening point glass composition, bonding material using same and electronic parts
HITACHI CHEMICAL CO LTD3 citations62
US7638564B2Dec 29, 2009
Low dielectric loss tangent-resin varnish, prepreg, laminated sheet, and printed wiring board using the varnish
HITACHI CHEMICAL CO LTD4 citations62