Inventor

INDUKURI TEJASWI K

US23 patents

⚠️ This page may combine multiple inventors who share the name “INDUKURI TEJASWI K”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INDUKURI TEJASWI K

INTEL CORP

Cobalt based interconnects and methods of fabrication thereof

Interconnect wires including relatively low resistivity cores

Decoupled via fill

Interconnect wires including relatively low resistivity cores

RRAM devices and their methods of fabrication

Seam healing of metal interconnects

Cobalt based interconnects and methods of fabrication thereof

Decoupled via fill

Interconnect wires including relatively low resistivity cores

Interconnect wires including relatively low resistivity cores

Interconnect wires including relatively low resistivity cores

Cobalt based interconnects and methods of fabrication thereof

Use of noble metals in the formation of conductive connectors

Decoupled via fill

Seam healing of metal interconnects

Spin transfer torque memory (STTM), methods of forming the same using a non-conformal insulator, and devices including the same

Interconnect wires including relatively low resistivity cores

Decoupled via fill

Forming barrier walls, capping, or alloys /compounds within metal lines

Spin transfer torque memory (STTM), methods of forming the same using volatile compound forming elements, and devices including the same

TAHOE RES LTD

Cobalt based interconnects and methods of fabrication thereof

Cobalt based interconnects and methods of fabrication thereof

JEZEWSKI CHRISTOPHER J

Cobalt based interconnects and methods of fabrication thereof