Inventor
CHEBIAM RAMANAN V
US25 patents
⚠️ This page may combine multiple inventors who share the name “CHEBIAM RAMANAN V”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
21 patentsUS6645567B2Nov 11, 2003
Electroless plating bath composition and method of using
INTEL CORP85 citations98
US9997457B2Jun 12, 2018
Cobalt based interconnects and methods of fabrication thereof
INTEL CORP12 citations92
US7149085B2Dec 12, 2006
Electroosmotic pump apparatus that generates low amount of hydrogen gas
INTEL CORP20 citations92
US9691657B2Jun 27, 2017
Interconnect wires including relatively low resistivity cores
INTEL CORP6 citations84
US9165824B2Oct 20, 2015
Interconnects with fully clad lines
INTEL CORP11 citations83
US7279231B2Oct 9, 2007
Electroless plating structure
INTEL CORP5 citations74
US7229922B2Jun 12, 2007
Method for making a semiconductor device having increased conductive material reliability
INTEL CORP6 citations74
US6908504B2Jun 21, 2005
Electroless plating bath composition and method of using
INTEL CORP10 citations74
US10832951B2Nov 10, 2020
Interconnect wires including relatively low resistivity cores
INTEL CORP1 citations73
US10068845B2Sep 4, 2018
Seam healing of metal interconnects
INTEL CORP3 citations73
US10700007B2Jun 30, 2020
Cobalt based interconnects and methods of fabrication thereof
INTEL CORP3 citations72
US7629252B2Dec 8, 2009
Conformal electroless deposition of barrier layer materials
INTEL CORP5 citations63
US7372165B2May 13, 2008
Method for making a semiconductor device having increased conductive material reliability
INTEL CORP3 citations63
US12266568B2Apr 1, 2025
Interconnect wires including relatively low resistivity cores
INTEL CORP0 citations62
US11881432B2Jan 23, 2024
Interconnect wires including relatively low resistivity cores
INTEL CORP0 citations62
US11569126B2Jan 31, 2023
Interconnect wires including relatively low resistivity cores
INTEL CORP0 citations62
US11328993B2May 10, 2022
Cobalt based interconnects and methods of fabrication thereof
INTEL CORP0 citations62
US11094587B2Aug 17, 2021
Use of noble metals in the formation of conductive connectors
INTEL CORP0 citations62
US10629525B2Apr 21, 2020
Seam healing of metal interconnects
INTEL CORP0 citations52
US9385085B2Jul 5, 2016
Interconnects with fully clad lines
INTEL CORP1 citations52
US9349636B2May 24, 2016
Interconnect wires including relatively low resistivity cores
INTEL CORP0 citations52