Inventor
NIAN JUN-NAN
TW19 patents
⚠️ This page may combine multiple inventors who share the name “NIAN JUN-NAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
15 patentsUS10269918B2Apr 23, 2019
N-work function metal with crystal structure
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US9870995B2Jan 16, 2018
Formation of copper layer structure with self anneal strain improvement
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11603602B2Mar 14, 2023
Method for controlling electrochemical deposition to avoid defects in interconnect structures
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11598016B2Mar 7, 2023
Electrochemical plating system and method of using
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11230784B2Jan 25, 2022
Electrochemical plating system and method of using
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11133395B2Sep 28, 2021
N-work function metal with crystal structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11015260B2May 25, 2021
Method for controlling electrochemical deposition to avoid defects in interconnect structures
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US9698019B2Jul 4, 2017
N-work function metal with crystal structure
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US12341055B2Jun 24, 2025
Method of manufacturing semiconductor devices and semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US10840184B2Nov 17, 2020
Formation of copper layer structure with self anneal strain improvement
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10879629B2Dec 29, 2020
Method of electroplating metal into recessed feature and electroplating layer in recessed feature
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10749278B2Aug 18, 2020
Method of electroplating metal into recessed feature and electroplating layer in recessed feature
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US12080751B2Sep 3, 2024
Semiconductor device structure and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US12362273B2Jul 15, 2025
Conductive structures and methods of fabrication thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations47
US12557619B2Feb 17, 2026
Semiconductor structure including multiple barrier layers and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations43