Inventor
LEE ING-JU
TW10 patents
⚠️ This page may combine multiple inventors who share the name “LEE ING-JU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
8 patentsUS11309265B2Apr 19, 2022
Methods of fabricating semiconductor devices having conductive pad structures with multi-barrier films
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations71
US11598016B2Mar 7, 2023
Electrochemical plating system and method of using
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11230784B2Jan 25, 2022
Electrochemical plating system and method of using
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12051659B2Jul 30, 2024
Semiconductor devices having conductive pad structures with multi-barrier films
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11688703B2Jun 27, 2023
Methods of fabricating semiconductor devices having conductive pad structures with multi-barrier films
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11018176B2May 25, 2021
Metal shielding layer in backside illumination image sensor chips and methods for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US9620555B2Apr 11, 2017
Metal shielding layer in backside illumination image sensor chips and methods for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations60
US10276621B2Apr 30, 2019
Metal shielding layer in backside illumination image sensor chips and methods for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50