Inventor
BYUN JUNGSOO
KR5 patents
Patents
5 patentsUS11289456B2Mar 29, 2022
Semiconductor package
SAMSUNG ELECTRONICS CO LTD3 citations70
US11088115B2Aug 10, 2021
Interposer and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD4 citations68
US12015014B2Jun 18, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations59
US12218099B2Feb 4, 2025
Interposer and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD0 citations57
US11581263B2Feb 14, 2023
Semiconductor package, and package on package having the same
SAMSUNG ELECTRONICS CO LTD0 citations48