Inventor
MEYER HEIDI M
US8 patents
Patents
8 patentsUS10930753B2Feb 23, 2021
Trench isolation for advanced integrated circuit structure fabrication
INTEL CORP1 citations83
US11881520B2Jan 23, 2024
Fin patterning for advanced integrated circuit structure fabrication
INTEL CORP2 citations82
US11640985B2May 2, 2023
Trench isolation for advanced integrated circuit structure fabrication
INTEL CORP0 citations72
US12538545B2Jan 27, 2026
Fin patterning for advanced integrated circuit structure fabrication
INTEL CORP0 citations71
US10879241B2Dec 29, 2020
Techniques for controlling transistor sub-fin leakage
INTEL CORP1 citations62
US12557617B2Feb 17, 2026
Continuous gate and fin spacer for advanced integrated circuit structure fabrication
INTEL CORP0 citations59
US11837456B2Dec 5, 2023
Continuous gate and fin spacer for advanced integrated circuit structure fabrication
INTEL CORP0 citations59
US11462436B2Oct 4, 2022
Continuous gate and fin spacer for advanced integrated circuit structure fabrication
INTEL CORP0 citations59