Inventor
HONG YI KOAN
KR13 patents
⚠️ This page may combine multiple inventors who share the name “HONG YI KOAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
12 patentsUS9865581B2Jan 9, 2018
Method of fabricating multi-substrate semiconductor devices
SAMSUNG ELECTRONICS CO LTD25 citations93
US9530706B2Dec 27, 2016
Semiconductor devices having hybrid stacking structures and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD13 citations83
US11295981B2Apr 5, 2022
Semiconductor devices including through vias and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD3 citations72
US10734430B2Aug 4, 2020
Semiconductor device including through via, semiconductor package, and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD1 citations72
US9502274B2Nov 22, 2016
Wafer loaders having buffer zones
SAMSUNG ELECTRONICS CO LTD3 citations72
US9653623B2May 16, 2017
Methods of manufacturing a semiconductor device
SAMSUNG ELECTRONICS CO LTD6 citations71
US12107109B2Oct 1, 2024
Semiconductor device including through via, semiconductor package, and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US11791211B2Oct 17, 2023
Semiconductor devices including through vias and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US11626443B2Apr 11, 2023
Semiconductor device including through via, semiconductor package, and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US10978655B2Apr 13, 2021
Semiconductor devices
SAMSUNG ELECTRONICS CO LTD0 citations62
US10446774B2Oct 15, 2019
Semiconductor devices
SAMSUNG ELECTRONICS CO LTD1 citations62
US9431341B2Aug 30, 2016
Semiconductor device having metal patterns and piezoelectric patterns
SAMSUNG ELECTRONICS CO LTD0 citations52