Inventor

YAGOURA HIDEYA

JP8 patents

Patents

8 patents

US5157478AOct 20, 1992

Tape automated bonding packaged semiconductor device incorporating a heat sink

MITSUBISHI ELECTRIC CORP65 citations95

US5064706ANov 12, 1991

Carrier tape including molten resin flow path element for resin packaged semiconductor devices

MITSUBISHI ELECTRIC CORP29 citations92

US4945391AJul 31, 1990

Semiconductor device housing with laser diode and light receiving element

MITSUBISHI ELECTRIC CORP20 citations81

US5055912AOct 8, 1991

Semiconductor device

MITSUBISHI ELECTRIC CORP16 citations73

US5412157AMay 2, 1995

Semiconductor device

MITSUBISHI ELECTRIC CORP8 citations72

US4839713AJun 13, 1989

Package structure for semiconductor device

MITSUBISHI ELECTRIC CORP17 citations71

US5359203AOct 25, 1994

Laser OLB apparatus and method of mounting semiconductor device

MITSUBISHI ELECTRIC CORP13 citations68

US4826068AMay 2, 1989

Outer lead bonding device utilizing tape carriers

MITSUBISHI ELECTRIC CORP6 citations62