Inventor

TERAOKA YASUHIRO

JP4 patents

Patents

4 patents

US5157478AOct 20, 1992

Tape automated bonding packaged semiconductor device incorporating a heat sink

MITSUBISHI ELECTRIC CORP65 citations95

US5064706ANov 12, 1991

Carrier tape including molten resin flow path element for resin packaged semiconductor devices

MITSUBISHI ELECTRIC CORP29 citations92

US5166099ANov 24, 1992

Manufacturing method for semiconductor device

MITSUBISHI ELECTRIC CORP39 citations89

US4839713AJun 13, 1989

Package structure for semiconductor device

MITSUBISHI ELECTRIC CORP17 citations71