Inventor
SUGAI KAZUMI
JP16 patents
⚠️ This page may combine multiple inventors who share the name “SUGAI KAZUMI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NEC CORP
15 patentsUS6509649B1Jan 21, 2003
Semiconductor device and fabricating method thereof
NEC CORP25 citations92
US6143671ANov 7, 2000
Semiconductor device manufacturing method
NEC CORP24 citations92
US6083832AJul 4, 2000
Method of manufacturing semiconductor device
NEC CORP24 citations92
US5993546ANov 30, 1999
Apparatus for forming a solid thin film from a layer of liquid material without void
NEC CORP17 citations92
US5545591AAug 13, 1996
Method for forming an aluminum film used as an interconnect in a semiconductor device
NEC CORP28 citations90
US6465354B1Oct 15, 2002
Method of improving the planarization of wiring by CMP
NEC CORP10 citations73
US6403468B1Jun 11, 2002
Method for forming embedded metal wiring
NEC CORP8 citations73
US6368981B1Apr 9, 2002
Method of manufacturing semiconductor device and chemical mechanical polishing apparatus
NEC CORP12 citations73
US6268090B1Jul 31, 2001
Process for manufacturing semiconductor device and exposure mask
NEC CORP14 citations73
US6184131B1Feb 6, 2001
Process of forming solid thin film from layer of liquid material without void and film forming apparatus used therein
NEC CORP7 citations73
US6123992ASep 26, 2000
Method of forming aluminum interconnection layer
NEC CORP11 citations73
US6496255B2Dec 17, 2002
Measurement of crystal face orientation
NEC CORP5 citations63
US6174563B1Jan 16, 2001
Method for forming thin metal films
NEC CORP5 citations62
US6114236ASep 5, 2000
Process for production of semiconductor device having an insulating film of low dielectric constant
NEC CORP4 citations62
US5793479AAug 11, 1998
Thin-film formation device and method
NEC CORP4 citations61