Inventor
NGUYEN LUU
US14 patents
⚠️ This page may combine multiple inventors who share the name “NGUYEN LUU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NAT SEMICONDUCTOR CORP
8 patentsUS6384397B1May 7, 2002
Low cost die sized module for imaging application having a lens housing assembly
NAT SEMICONDUCTOR CORP215 citations98
US6238949B1May 29, 2001
Method and apparatus for forming a plastic chip on chip package module
NAT SEMICONDUCTOR CORP156 citations98
US6245595B1Jun 12, 2001
Techniques for wafer level molding of underfill encapsulant
NAT SEMICONDUCTOR CORP161 citations97
US6707140B1Mar 16, 2004
Arrayable, scaleable, and stackable molded package configuration
NAT SEMICONDUCTOR CORP87 citations95
US6352881B1Mar 5, 2002
Method and apparatus for forming an underfill adhesive layer
NAT SEMICONDUCTOR CORP70 citations94
US7098540B1Aug 29, 2006
Electrical interconnect with minimal parasitic capacitance
NAT SEMICONDUCTOR CORP67 citations93
US6364542B1Apr 2, 2002
Device and method for providing a true semiconductor die to external fiber optic cable connection
NAT SEMICONDUCTOR CORP55 citations93
US7703993B1Apr 27, 2010
Wafer level optoelectronic package with fiber side insertion
NAT SEMICONDUCTOR CORP26 citations90
TEXAS INSTRUMENTS INC
5 patentsUS9663357B2May 30, 2017
Open cavity package using chip-embedding technology
TEXAS INSTRUMENTS INC12 citations83
US10516381B2Dec 24, 2019
3D-printed protective shell structures for stress sensitive circuits
TEXAS INSTRUMENTS INC2 citations68
US11082028B2Aug 3, 2021
3D-printed protective shell structures with support columns for stress sensitive circuits
TEXAS INSTRUMENTS INC0 citations58
US10077186B2Sep 18, 2018
Integrated circuit package with sensor and method of making
TEXAS INSTRUMENTS INC1 citations52
US9688530B2Jun 27, 2017
Integrated circuit package with sensor and method of making
TEXAS INSTRUMENTS INC1 citations52