Inventor

GARDNER JAMES MICHAEL

US135 patents

⚠️ This page may combine multiple inventors who share the name “GARDNER JAMES MICHAEL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HEWLETT PACKARD DEVELOPMENT CO

48 patents

US10875318B1Dec 29, 2020

Logic circuitry

HEWLETT PACKARD DEVELOPMENT CO31 citations97

US11034157B2Jun 15, 2021

Logic circuitry

HEWLETT PACKARD DEVELOPMENT CO29 citations94

US10894423B2Jan 19, 2021

Logic circuitry

HEWLETT PACKARD DEVELOPMENT CO29 citations94

US11511539B2Nov 29, 2022

Memories of fluidic dies

HEWLETT PACKARD DEVELOPMENT CO6 citations86

US11453212B2Sep 27, 2022

Print component with memory circuit

HEWLETT PACKARD DEVELOPMENT CO9 citations86

US11364719B2Jun 21, 2022

Print component with memory array using intermittent clock signal

HEWLETT PACKARD DEVELOPMENT CO7 citations86

US11331924B2May 17, 2022

Logic circuitry package

HEWLETT PACKARD DEVELOPMENT CO6 citations86

US11141973B2Oct 12, 2021

Integrated circuits including memory cells

HEWLETT PACKARD DEVELOPMENT CO4 citations84

US10940693B1Mar 9, 2021

Logic circuitry

HEWLETT PACKARD DEVELOPMENT CO3 citations84

US10099473B2Oct 16, 2018

Evaluating print nozzle condition

HEWLETT PACKARD DEVELOPMENT CO6 citations84

US9931837B2Apr 3, 2018

Modules to identify nozzle chamber operation

HEWLETT PACKARD DEVELOPMENT CO5 citations84

US11312146B2Apr 26, 2022

Logic circuitry package

HEWLETT PACKARD DEVELOPMENT CO2 citations83

US11780222B2Oct 10, 2023

Print component with memory circuit

HEWLETT PACKARD DEVELOPMENT CO1 citations73

US11667116B2Jun 6, 2023

Print component having fluidic actuating structures with different fluidic architectures

HEWLETT PACKARD DEVELOPMENT CO2 citations73

US11559985B2Jan 24, 2023

Integrated circuit with address drivers for fluidic die

HEWLETT PACKARD DEVELOPMENT CO3 citations73

US11491782B2Nov 8, 2022

Print component with memory circuit

HEWLETT PACKARD DEVELOPMENT CO1 citations73

US11479046B2Oct 25, 2022

Logic circuitry for sensor data communications

HEWLETT PACKARD DEVELOPMENT CO1 citations73

US11413864B2Aug 16, 2022

Die for a printhead

HEWLETT PACKARD DEVELOPMENT CO3 citations73

US11413862B2Aug 16, 2022

Print component having fluidic actuating structures with different fluidic architectures

HEWLETT PACKARD DEVELOPMENT CO2 citations73

US11413865B2Aug 16, 2022

Fluid ejection devices including contact pads

HEWLETT PACKARD DEVELOPMENT CO2 citations73

US11407218B2Aug 9, 2022

Identifying random bits in control data packets

HEWLETT PACKARD DEVELOPMENT CO2 citations73

US11250146B2Feb 15, 2022

Logic circuitry

HEWLETT PACKARD DEVELOPMENT CO3 citations73

US10960658B2Mar 30, 2021

Detecting a level of printable fluid in a container

HEWLETT PACKARD DEVELOPMENT CO3 citations73

US10940694B2Mar 9, 2021

Detecting fluid levels using a variable threshold voltage

HEWLETT PACKARD DEVELOPMENT CO2 citations73

US10926548B2Feb 23, 2021

Printing apparatus and methods for detecting fluid levels

HEWLETT PACKARD DEVELOPMENT CO2 citations73

US11345158B2May 31, 2022

Logic circuitry package

HEWLETT PACKARD DEVELOPMENT CO2 citations72

US11351791B2Jun 7, 2022

Logic circuitry package

HEWLETT PACKARD DEVELOPMENT CO2 citations69

US12403689B2Sep 2, 2025

Print component with memory array using intermittent clock signal

HEWLETT PACKARD DEVELOPMENT CO0 citations63

US12350932B2Jul 8, 2025

Die for a printhead

HEWLETT PACKARD DEVELOPMENT CO0 citations63

US12240231B2Mar 4, 2025

Integrated circuit with address drivers for fluidic die

HEWLETT PACKARD DEVELOPMENT CO0 citations63

US12183430B2Dec 31, 2024

Communicating print component

HEWLETT PACKARD DEVELOPMENT CO0 citations63

US12145360B2Nov 19, 2024

Integrated circuits including memory cells

HEWLETT PACKARD DEVELOPMENT CO0 citations63

US12097695B2Sep 24, 2024

Accessing registers of fluid ejection devices

HEWLETT PACKARD DEVELOPMENT CO0 citations63

US11969995B2Apr 30, 2024

Integrated circuits including memory cells

HEWLETT PACKARD DEVELOPMENT CO0 citations63

US11969998B2Apr 30, 2024

Multiple circuits coupled to an interface

HEWLETT PACKARD DEVELOPMENT CO0 citations63

US11938722B2Mar 26, 2024

Integrated circuits including memory cells

HEWLETT PACKARD DEVELOPMENT CO0 citations63

US11912024B2Feb 27, 2024

Temperature detection and control

HEWLETT PACKARD DEVELOPMENT CO0 citations63

US11760085B2Sep 19, 2023

Accessing registers of fluid ejection devices

HEWLETT PACKARD DEVELOPMENT CO1 citations63

US11731419B2Aug 22, 2023

Integrated circuits including customization bits

HEWLETT PACKARD DEVELOPMENT CO0 citations63

US11701880B2Jul 18, 2023

Die for a printhead

HEWLETT PACKARD DEVELOPMENT CO0 citations63

US11685153B2Jun 27, 2023

Communicating print component

HEWLETT PACKARD DEVELOPMENT CO0 citations63

US11676645B2Jun 13, 2023

Communicating print component

HEWLETT PACKARD DEVELOPMENT CO1 citations63

US11628667B2Apr 18, 2023

Multiple circuits coupled to an interface

HEWLETT PACKARD DEVELOPMENT CO0 citations63

US11613118B2Mar 28, 2023

Die for a printhead

HEWLETT PACKARD DEVELOPMENT CO0 citations63

US11613117B2Mar 28, 2023

Multiple circuits coupled to an interface

HEWLETT PACKARD DEVELOPMENT CO0 citations63

US11602932B2Mar 14, 2023

Zonal firing signal adjustments

HEWLETT PACKARD DEVELOPMENT CO0 citations63

US11529805B2Dec 20, 2022

Communicating print component

HEWLETT PACKARD DEVELOPMENT CO0 citations63

US11479036B2Oct 25, 2022

Temperature detection and control

HEWLETT PACKARD DEVELOPMENT CO0 citations63

HEWLETT PACKARD DEVELOPMENT CO LP

2 patents

US9472288B2Oct 18, 2016

Mitigating parasitic current while programming a floating gate memory array

HEWLETT PACKARD DEVELOPMENT CO LP13 citations84

US9579885B2Feb 28, 2017

Method and system to store drop counts

HEWLETT PACKARD DEVELOPMENT CO LP5 citations73

Showing the top 50 of 135 patents by PatentIndex Score.