Inventor
ZLUC ANDREAS
AT29 patents
⚠️ This page may combine multiple inventors who share the name “ZLUC ANDREAS”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
AT & S AUSTRIA TECH & SYSTEMTECHNIK AG
17 patentsUS10779413B2Sep 15, 2020
Method of embedding a component in a printed circuit board
AT & S AUSTRIA TECH & SYSTEMTECHNIK AG8 citations82
US10617012B2Apr 7, 2020
Methods of manufacturing flexible printed circuit boards
AT & S AUSTRIA TECH & SYSTEMTECHNIK AG5 citations73
US10187997B2Jan 22, 2019
Method for making contact with a component embedded in a printed circuit board
AT & S AUSTRIA TECH & SYSTEMTECHNIK AG5 citations72
US10765005B2Sep 1, 2020
Embedding component with pre-connected pillar in component carrier
AT & S AUSTRIA TECH & SYSTEMTECHNIK AG2 citations68
US12400968B2Aug 26, 2025
Component with dielectric layer for embedding in component carrier
AT & S AUSTRIA TECH & SYSTEMTECHNIK AG0 citations62
US12185478B2Dec 31, 2024
Printed circuit board having embedded component
AT & S AUSTRIA TECH & SYSTEMTECHNIK AG0 citations62
US11749613B2Sep 5, 2023
Component with dielectric layer for embedding in component carrier
AT & S AUSTRIA TECH & SYSTEMTECHNIK AG0 citations62
US11682661B2Jun 20, 2023
Hermetic optical component package having organic portion and inorganic portion
AT & S AUSTRIA TECH & SYSTEMTECHNIK AG0 citations62
US11523520B2Dec 6, 2022
Method for making contact with a component embedded in a printed circuit board
AT & S AUSTRIA TECH & SYSTEMTECHNIK AG1 citations62
US11171092B2Nov 9, 2021
Component with dielectric layer for embedding in component carrier
AT & S AUSTRIA TECH & SYSTEMTECHNIK AG0 citations62
US12501551B2Dec 16, 2025
Method for embedding a component in a printed circuit board
AT & S AUSTRIA TECH & SYSTEMTECHNIK AG0 citations61
US11658142B2May 23, 2023
Connection arrangement, component carrier and method of forming a component carrier structure
AT & S AUSTRIA TECH & SYSTEMTECHNIK AG0 citations61
US11495513B2Nov 8, 2022
Component carrier with embedded semiconductor component and embedded highly-conductive block which are mutually coupled
AT & S AUSTRIA TECH & SYSTEMTECHNIK AG0 citations61
US12075561B2Aug 27, 2024
Embedding component in component carrier by component fixation structure
AT & S AUSTRIA TECH & SYSTEMTECHNIK AG0 citations59
US12165940B2Dec 10, 2024
Component carrier with surface-contactable component embedded in laminated stack
AT & S AUSTRIA TECH & SYSTEMTECHNIK AG0 citations51
US12245377B2Mar 4, 2025
Component carrier with embedded semiconductor component and embedded highly-conductive block which are mutually coupled
AT & S AUSTRIA TECH & SYSTEMTECHNIK AG0 citations50
US11570897B2Jan 31, 2023
Component embedded in component carrier and having an exposed side wall
AT & S AUSTRIA TECH & SYSTEMTECHNIK AG0 citations48
AUSTRIA TECH & SYSTEM TECH
6 patentsUS11749573B2Sep 5, 2023
Component carrier with a stepped cavity and a stepped component assembly embedded within the stepped cavity
AUSTRIA TECH & SYSTEM TECH0 citations62
US11049778B2Jun 29, 2021
Component carrier with a stepped cavity and a stepped component assembly embedded within the stepped cavity
AUSTRIA TECH & SYSTEM TECH0 citations62
US10709023B2Jul 7, 2020
Placement of component in circuit board intermediate product by flowable adhesive layer on carrier substrate
AUSTRIA TECH & SYSTEM TECH0 citations50
US10426040B2Sep 24, 2019
Method for producing a circuit board element
AUSTRIA TECH & SYSTEM TECH0 citations41
US10306750B2May 28, 2019
Circuit board and method for manufacturing a circuit board
AUSTRIA TECH & SYSTEM TECH0 citations39
US9967972B2May 8, 2018
Circuit board having an asymmetric layer structure
AUSTRIA TECH & SYSTEM TECH0 citations37
WEIDINGER GERALD
2 patentsUS9253888B2Feb 2, 2016
Method for integrating an electronic component into a printed circuit board or a printed circuit board intermediate product, and printed circuit board or printed circuit board intermediate product
WEIDINGER GERALD9 citations82
US8541689B2Sep 24, 2013
Method for removing a part of a planar material layer and multilayer structure
WEIDINGER GERALD2 citations60