Inventor
SAHASRABUDHE SHUBHADA H
US7 patents
Patents
7 patentsUS9368461B2Jun 14, 2016
Contact pads for integrated circuit packages
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US9953934B2Apr 24, 2018
Warpage controlled package and method for same
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US9659908B1May 23, 2017
Systems and methods for package on package through mold interconnects
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US7411296B2Aug 12, 2008
Method, system, and apparatus for gravity assisted chip attachment
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US11276625B2Mar 15, 2022
Methods of forming flexure based cooling solutions for package structures
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US11469185B2Oct 11, 2022
Standoff members for semiconductor package
INTEL CORP0 citations50
US10181432B2Jan 15, 2019
Computing system with a thermal interface comprising magnetic particles
INTEL CORP0 citations48