Inventor
CHENG CHI-HSUAN
TW10 patents
⚠️ This page may combine multiple inventors who share the name “CHENG CHI-HSUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNITED MICROELECTRONICS CORP
7 patentsUS10109531B1Oct 23, 2018
Semiconductor structure having a bump lower than a substrate base and a width of the bump larger than a width of fin shaped structures, and manufacturing method thereof
UNITED MICROELECTRONICS CORP31 citations92
US10283415B2May 7, 2019
Semiconductor structure with a bump having a width larger than a width of fin shaped structures and manufacturing method thereof
UNITED MICROELECTRONICS CORP8 citations82
US12414481B2Sep 9, 2025
Semiconductor device and method for fabricating the same
UNITED MICROELECTRONICS CORP1 citations63
US10217866B2Feb 26, 2019
Semiconductor device and method of forming the same
UNITED MICROELECTRONICS CORP1 citations61
US11043596B2Jun 22, 2021
Semiconductor device and fabrication method thereof
UNITED MICROELECTRONICS CORP0 citations50
US10446682B2Oct 15, 2019
Method of forming semiconductor device
UNITED MICROELECTRONICS CORP0 citations50
US10211107B1Feb 19, 2019
Method of fabricating fins including removing dummy fins after fluorocarbon flush step and oxygen clean step
UNITED MICROELECTRONICS CORP0 citations40