Inventor

COTTE JOHN MICHAEL

US42 patents

⚠️ This page may combine multiple inventors who share the name “COTTE JOHN MICHAEL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

COTTE JOHN MICHAEL

IBM

Method for selective extraction of sacrificial place-holding material used in fabrication of air gap-containing interconnect structures

Versatile Si-based packaging with integrated passive components for mmWave applications

Versatile Si-based packaging with integrated passive components for mmWave applications

Liquid or supercritical carbon dioxide composition

Process of removing ion-implanted photoresist from a workpiece

Electromechanical device and a process of preparing same

Process of cleaning semiconductor processing, handling and manufacturing equipment

Process for depositing a film on a nanometer structure

Method for forming interconnects on semiconductor substrates and structures formed

Process for removing chemical mechanical polishing residual slurry

Process of drying semiconductor wafers using liquid or supercritical carbon dioxide

Electrode modification using an unzippable polymer paste

Selective chemical etching in microelectronics fabrication

Ta-TaN selective removal process for integrated device fabrication

Methods for fabricating silicon carriers with conductive through-vias with low stress and low defect density

Electrochemical etch for high tin solder bumps

Check valve for micro electro mechanical structure devices

Electrode modification using an unzippable polymer paste

Process of removing residue material from a precision surface

Process and apparatus for cleaning filters

Reflow of low melt solder tip C4&#39;s

Electrode modification using an unzippable polymer paste

Method of obtaining release-standing micro structures and devices by selective etch removal of protective and sacrificial layer using the same

Method for forming interconnects on semiconductor substrates and structures formed

Apparatus for cleaning filters

Process of providing a semiconductor device with electrical interconnection capability

Fixtures for processing a workpiece in a supercritical fluid

Downstop and bump bonds formation on substrates

Create a protected layer for interconnects and devices in a packaged quantum structure

Interposer chips and enclosures for quantum circuits

Combined backing plate and housing for use in bump bonded chip assembly

Combined backing plate and housing for use in bump bonded chip assembly

Electrical connections between dissimilar materials at cryogenic temperatures

Edge capacitive coupling for quantum chips

Electronic apparatus minimizing differential thermal contraction for cryogenic quantum computers

Process of removing residue from a precision surface using liquid or supercritical carbon dioxide composition

Method for fabricating a photovoltaic device by uniform plating on dielectric passivated through-wafer vias and interconnects

Method for fabricating a photovoltaic device by uniform plating on emitter-lined through-wafer vias and interconnects

COTTE JOHN MICHAEL

Through substrate vias

Through substrate vias

Package integrated soft magnetic film for improvement in on-chip inductor performance

Ta-TaN selective removal process for integrated device fabrication

Reflow of low melt solder tip C4's