Inventor
AHN SEUNG H
KR6 patents
⚠️ This page may combine multiple inventors who share the name “AHN SEUNG H”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
4 patentsUS5625221AApr 29, 1997
Semiconductor assembly for a three-dimensional integrated circuit package
SAMSUNG ELECTRONICS CO LTD296 citations97
US5594275AJan 14, 1997
J-leaded semiconductor package having a plurality of stacked ball grid array packages
SAMSUNG ELECTRONICS CO LTD281 citations97
US5552635ASep 3, 1996
High thermal emissive semiconductor device package
SAMSUNG ELECTRONICS CO LTD280 citations97
US5504373AApr 2, 1996
Semiconductor memory module
SAMSUNG ELECTRONICS CO LTD36 citations87