Inventor · disambiguated record

Dae-Wook Yang

Also filed as: YANG DAE-WOOK

3 granted patents·61 citations·filing 2006–2008

73Inventor score

Technology areasH10W

Files withSTATS CHIPPAC LTD3

Top patents by PatentIndex Score

3 records

0193US7851893B2Semiconductor device and method of connecting a shielding layer to ground through conductive viasSTATS CHIPPAC LTD·Filed 2008·Granted Dec 14, 2010·40 cites·25 claims
0285US7485502B2Integrated circuit underfill package systemSTATS CHIPPAC LTD·Filed 2006·Granted Feb 3, 2009·13 cites·10 claims
0379US7741726B2Integrated circuit underfill package systemSTATS CHIPPAC LTD·Filed 2008·Granted Jun 22, 2010·8 cites·9 claims

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