Inventor
WALCZYK JOE F
US11 patents
⚠️ This page may combine multiple inventors who share the name “WALCZYK JOE F”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
9 patentsUS9523713B2Dec 20, 2016
Interconnects including liquid metal
INTEL CORP5 citations71
US12341281B2Jun 24, 2025
Micro socket electrical couplings for dies
INTEL CORP0 citations61
US11398414B2Jul 26, 2022
Sloped metal features for cooling hotspots in stacked-die packages
INTEL CORP0 citations61
US12061230B2Aug 13, 2024
Active optical plug to optically or electrically test a photonics package
INTEL CORP0 citations60
US11935860B2Mar 19, 2024
Electrical connector with insulated conductive layer
INTEL CORP0 citations50
US11581237B2Feb 14, 2023
Cooling apparatuses for microelectronic assemblies
INTEL CORP0 citations50
US12135460B2Nov 5, 2024
Stackable photonics die with direct optical interconnect
INTEL CORP0 citations49
US11592472B2Feb 28, 2023
Thermal switch for rapid thermal coupling and decoupling of devices under test
INTEL CORP0 citations48
US10324112B2Jun 18, 2019
Package testing system and method with contact alignment
INTEL CORP0 citations34