Inventor · disambiguated record
Roman Milter
Also filed as: MILTER ROMAN · MILTER ROMAN L
6 granted patents·5 pending applications·201 citations·filing 2003–2017
85Inventor score
Top patents by PatentIndex Score
11 records- 0198US7621761B2Systems for testing and packaging integrated circuitsNANONEXUS INC·Filed 2007·Granted Nov 24, 2009·83 cites·18 claims
- 0295US7247035B2Enhanced stress metal spring contactorNANONEXUS INC·Filed 2004·Granted Jul 24, 2007·61 cites·22 claims
- 0386US7126220B2Miniaturized contact springNANONEXUS INC·Filed 2003·Granted Oct 24, 2006·40 cites·25 claims
- 0476US9577140B2Low-cost solar cell metallization over TCO and methods of their fabricationSINHA ASHOK·Filed 2015·Granted Feb 21, 2017·3 cites·13 claims
- 0570US7137830B2Miniaturized contact springNANONEXUS INC·Filed 2003·Granted Nov 21, 2006·14 cites·30 claims
- 0658US2013125968A1Low-cost solar cell metallization over tco and methods of their fabricationSINHA ASHOK KUMAR·Filed 2011·Application pending·0 cites
- 0747US2007144841A1Miniaturized Contact SpringCHONG FU C·Filed 2006·Application pending·0 cites
- 0843US2007245553A1Fine pitch microfabricated spring contact structure & methodCHONG FU C·Filed 2007·Application pending·0 cites
- 0942US2012023730A1Construction structures and manufacturing processes for integrated circuit wafer probe card assembliesCHONG FU CHIUNG·Filed 2011·Application pending·0 cites
- 1039US9876135B2Method for forming copper metallization over TCO of solar cellsSINHA K ASHOK·Filed 2017·Granted Jan 23, 2018·0 cites·20 claims
- 1136US2012212248A9Construction Structures and Manufacturing Processes for Integrated Circuit Wafer Probe Card AssembliesCHONG FU CHIUNG·Filed 2007·Application pending·0 cites
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