Inventor
LIU CHUNG
US17 patents
⚠️ This page may combine multiple inventors who share the name “LIU CHUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG
4 patentsUS6468908B1Oct 22, 2002
Al-Cu alloy sputtering method with post-metal quench
TAIWAN SEMICONDUCTOR MFG25 citations86
US6875682B1Apr 5, 2005
Mesh pad structure to eliminate IMD crack on pad
TAIWAN SEMICONDUCTOR MFG10 citations72
US7759797B2Jul 20, 2010
Bonding pad structure to minimize IMD cracking
TAIWAN SEMICONDUCTOR MFG1 citations61
US7135395B2Nov 14, 2006
Bonding pad structure to minimize IMD cracking
TAIWAN SEMICONDUCTOR MFG2 citations61
SAMSUNG ELECTRONICS CO LTD
3 patentsUS10891620B2Jan 12, 2021
Method for risk management based on aggregated information from multiple payment networks while maintaining anonymity of user
SAMSUNG ELECTRONICS CO LTD2 citations64
US11657386B2May 23, 2023
Reference-based card enrollment for secondary devices
SAMSUNG ELECTRONICS CO LTD0 citations42
US10410205B2Sep 10, 2019
Apparatus and method for performing payment transaction using dynamic MST configuration
SAMSUNG ELECTRONICS CO LTD0 citations42
APPLIED MATERIALS INC
3 patentsUS12125699B2Oct 22, 2024
Selective carbon deposition on top and bottom surfaces of semiconductor substrates
APPLIED MATERIALS INC0 citations58
US9741566B2Aug 22, 2017
Methods for manufacturing a spacer with desired profile in an advanced patterning process
APPLIED MATERIALS INC1 citations47
US12237149B2Feb 25, 2025
Reducing aspect ratio dependent etch with direct current bias pulsing
APPLIED MATERIALS INC0 citations43