Inventor · disambiguated record

Yen-Ni Hu

Also filed as: HU YEN-NI

1 granted patent·0 citations·filing 2016–2016

1Inventor score

Technology areasH01L

Files withZOWIE TECH CORPORATION1

Top patents by PatentIndex Score

1 record

0117US10679965B2Semiconductor package structure with preferred heat dissipating efficacy without formation of short circuitZOWIE TECH CORPORATION·Filed 2016·Granted Jun 9, 2020·0 cites·24 claims

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