Inventor

LIN YU-WEI

TW55 patents

⚠️ This page may combine multiple inventors who share the name “LIN YU-WEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIN YU-WEI

TAIWAN SEMICONDUCTOR MFG CO LTD

Substrate design with balanced metal and solder resist density

Interconnection structure and method of forming same

Semiconductor structure and manufacturing method thereof

Protrusion bump pads for bond-on-trace processing

Protrusion bump pads for bond-on-trace processing

Memory devices, semiconductor devices, and methods of operating a memory device

Memory device and operating method thereof

Semiconductor device and programmable macro circuit

Substrate design with balanced metal and solder resist density

Memory devices, semiconductor devices, and methods of operations a memory device

Solderless interconnection structure and method of forming same

Solderless interconnection structure and method of forming same

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Solderless interconnection structure and method of forming same

Integrated circuit packaging substrate, semiconductor package, and manufacturing method

Micro-electro-mechanical systems (MEMS), apparatus, and operating methods thereof

Bump structure and method of forming same

Semiconductor package and manufacturing method of the same

Semiconductor package and manufacturing method of the same

DIODES INC

Bit-level mode retimer

Phase interpolator circuitry for a bit-level mode retimer

Data correction and phase optimization in high-speed receivers

Clock signal skew calibration apparatus and control method

TAIWAN SEMICONDUCTOR MFG

Micro-electro-mechanical systems (MEMS), systems, and operating methods thereof

Substrate design with balanced metal and solder resist density

Bump structure and method of forming same

LIN YU-WEI

Calibration circuit and calibration method

Hinge mechanism and clamshell device thereof

Input common mode circuit

UNIV MICHIGAN

Micromechanical structures having a capacitive transducer gap filled with a dielectric and method of making same

Resonator system such as a microresonator system and method of making same

VIA TECH INC

Clock generating apparatus and method thereof

Phase-detecting device

WISTRON CORP

Hinge mechanism and clamshell device thereof

Key mechanism with easy assembly

LIN YU WEI

Tool handle

Hand tool rack

GRAND TEK TECHNOLOGY CO LTD

Antenna fixing structure

Antenna sheath

PEGATRON CORP

Fastener and housing device including the fastener

Rollable structure and electronic device using same

SILICONWARE PRECISION INDUSTRIES CO LTD

Carrier-free semiconductor package and fabrication method thereof

GRAND TEK TECH CO LTD

Waterproof enhanced RF connector

GRAND-TEK TECH CO LTD

Antenna housing

PENG YUNG-CHOW

Micro-electro-mechanical systems (MEMS), systems, and operating methods thereof

CHEN CHIA-JUNG

Quick-release fixing structure for electronic equipments

CHEN CHIH-PING

Fullerene derivatives and optoelectronic devices utilizing the same

UNIV NAT CHENG KUNG

Memory system capable of performing a bit partitioning process and an internal computation process

SHIP & OCEAN IND R & D CT

Vessel power safety control system and operating method thereof